Electronic apparatus

Abstract

According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.

1. An electronic apparatus comprising:
 a semiconductor package comprising a resin substrate and a die mounted on the resin substrate; 
 a printed circuit board on which the semiconductor package is mounted; and 
 a heat receiving plate having an area larger than an area of the die, wherein 
 the heat receiving plate has a concave portion corresponding to a shape of a surface of the die at a normal temperature, 
 the concave portion is provided with a pasty heat conductive agent, and 
 the heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent. 
 
     
     
       2. The electronic apparatus according to  claim 1 , wherein the concave portion is positioned in an inner side with respect to a position corresponding to a circumference of the surface of the die. 
     
     
       3. The electronic apparatus according to  claim 1 , wherein
 a volume of a space formed between the concave portion and the surface of the die at the normal temperature is equal to a volume of the pasty heat conductive agent at the normal temperature, and 
 the volume of the space between the concave portion and the surface of the die when the die is at a first temperature within an operation temperature range is equal to the volume of the pasty heat conductive agent when the die is at the first temperature. 
 
     
     
       4. The electronic apparatus according to  claim 1 , wherein the concave portion is formed by a curved surface. 
     
     
       5. The electronic apparatus according to claim X, further comprising:
 a discharge hole; 
 a heat radiation fin that is opposed to the discharge hole; and 
 a heat conductive member that thermally connects the die and the heat radiating fin. 
 
     
     
       6. An electronic apparatus comprising:
 a semiconductor package comprising a resin substrate and a die mounted on the resin substrate; 
 a printed circuit board on which the semiconductor package is mounted; and 
 a heat receiving plate having an area larger than an area of the die, wherein 
 the die has a concave portion that is provided with a pasty heat conductive agent, and 
 the die is thermally connected to the heat receiving plate via the pasty heat conductive agent.