P
US7784146B2ExpiredUtilityPatentIndex 35

Probe tip cleaning apparatus and method of use

Assignee: IBMPriority: Jan 9, 2006Filed: Jan 9, 2006Granted: Aug 31, 2010
Est. expiryJan 9, 2026(expired)· nominal 20-yr term from priority
Inventors:FEROLI RONALD A
B08B 1/10B08B 1/12G01R 3/00B08B 15/04A46B 13/00
35
PatentIndex Score
0
Cited by
25
References
20
Claims

Abstract

Apparatus for the method, including cartridges for housing strips of cleaning pad material, are provided. A method for cleaning probe tips, e.g., on a probe card, comprises abrading the probe tips on an abrasive surface, and advancing the abrasive surface so that a later cleaning cycle uses a clean portion of the cleaning pad. The method may include use of a vacuum to aspirate material dislodged by the abrading. In another aspect, a method for cleaning probe tips includes brushing the probe tips and operating a vacuum to aspirate material from the probe tips and/or brush. The methods may be used singly or in combination.

Claims

exact text as granted — not AI-modified
1. A cartridge comprising a cleaning pad, a cleaning pad supply portion, a cleaning pad take-up portion, the cartridge being designed and configured to fit into a cleaning portion of a wafer prober, and a window in a surface of the cartridge and positioned between the cleaning pad supply portion and cleaning pad take-up portion, the window being positioned and arranged to permit access to a portion of a cleaning surface of the cleaning pad. 
     
     
       2. The cartridge of  claim 1 , further comprising a tensioner structured to place tension on the cleaning pad. 
     
     
       3. The cartridge of  claim 2 , wherein the tensioner is one of a pinch roller and opposing arms. 
     
     
       4. The cartridge of  claim 1 , further comprising a scrubber vacuum positioned and arranged to aspirate material on a contact pad. 
     
     
       5. The cartridge of  claim 1 , further comprising a vacuum for drawing the cleaning pad toward a backing surface. 
     
     
       6. The cartridge of  claim 1 , further comprising a pair of rollers to maintain a tension in the cleaning pad. 
     
     
       7. The cartridge of  claim 1 , further comprising opposing non-rolling members to squeeze and provide a level of tension to the cleaning pad. 
     
     
       8. The cartridge of  claim 1 , wherein the cleaning pad take-up portion is a pair of rollers. 
     
     
       9. The cartridge of  claim 1 , further comprising a brush adapted to brush a probe tip of the wafer prober. 
     
     
       10. A cartridge comprising a cleaning pad attachable between a cleaning pad supply portion and a cleaning pad take-up portion, the cartridge being designed and configured to fit into a cleaning portion of a wafer prober, and a brush positioned between the cleaning pad supply portion and the cleaning pad take-up portion and positioned and adapted to brush a probe tip of the wafer prober. 
     
     
       11. The method of  claim 10 , further comprising a brush vacuum positioned and adapted to aspirate material from the brush. 
     
     
       12. A cartridge comprising a cleaning pad attachable between a cleaning pad supply portion and a cleaning pad take-up portion, the cartridge being designed and configured to fit into a cleaning portion of a wafer prober, and a backing surface positioned such that a portion of the cleaning pad is between a window and the backing surface, wherein the backing surface is substantially planar and is provided with a plurality of openings. 
     
     
       13. The cartridge of  claim 12 , wherein at least one of the cleaning pad supply portion and the cleaning pad take-up portion is a rotatable spindle. 
     
     
       14. A probe cleaning apparatus comprising:
 a cleaning pad supply portion and a cleaning pad take-up portion; 
 a cleaning pad wound at least on the cleaning pad supply portion and dispensed in the cleaning pad take-up portion during use; 
 a scrubber vacuum positioned and arranged to aspirate material dislodged by the cleaning pad; 
 a backing surface having at least a portion adjacent to the cleaning pad; 
 a brush adapted and configured to brush a probe tip of a probe test apparatus; and 
 a brush vacuum positioned and arranged to aspirate material from the brush. 
 
     
     
       15. The probe cleaning apparatus of  claim 14 , further comprising a tensioner structured to place tension on the cleaning pad. 
     
     
       16. A probe cleaning apparatus comprising:
 a cleaning pad supply portion and a cleaning pad take-up portion; 
 a cleaning pad wound at least on the cleaning pad supply portion and dispensed in the cleaning pad take-up portion during use; 
 a scrubber vacuum positioned and arranged to aspirate material dislodged by the cleaning pad; 
 a backing surface having at least a portion adjacent to the cleaning pad; and 
 a window positioned between the cleaning pad supply portion and the cleaning pad take-up portion to provide access to the cleaning pad. 
 
     
     
       17. A probe cleaning apparatus comprising:
 a cleaning pad supply portion and a cleaning pad take-up portion; 
 a cleaning pad wound at least on the cleaning pad supply portion and dispensed in the cleaning pad take-up portion during use; 
 a scrubber vacuum positioned and arranged to aspirate material dislodged by the cleaning pad; and 
 a backing surface having at least a portion adjacent to the cleaning pad, 
 wherein the backing surface is substantially planar, and 
 the backing surface is provided with a plurality of openings, the apparatus further comprising a backing surface vacuum for drawing the cleaning pad toward the backing surface. 
 
     
     
       18. A method of cleaning a probe tip comprising contacting a probe tip with a surface of a cleaning pad, abrading the probe tip with the cleaning pad, advancing the cleaning pad in a direction parallel to the surface of the cleaning pad, and contacting the probe tip with a brush to dislodge, and vacuuming material from the brush. 
     
     
       19. The method of  claim 18 , further comprising operating a scrubber vacuum positioned and arranged to aspirate material dislodged by the abrading. 
     
     
       20. The method of  claim 18 , further comprising operating a backing surface vacuum for drawing the cleaning pad toward the backing surface.

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References (0)

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