High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

Abstract

Provided are a high-power ball grid array (BGA) and a method for manufacturing the high-power BGA. The high-power BGA includes a printed circuit board which has a through hole at its center, connection pads which are formed on the bottom of the printed circuit board, matrix solder balls which surround the through hole and are adjacent to the connection pads on the bottom of the printed circuit board, a heat spreader which is formed on the top surface of the printed circuit board and includes an insulating layer of a high thermal conductivity, a semiconductor chip which is mounted downwardly on the bottom surface of the heat spreader, within the through hole, and includes a plurality of pads for bonding via gold wires with the connection pad, and a passive film which fills the through hole and is formed at the bottom of the semiconductor chip. By interposing a ceramic between the semiconductor chip and the heat spreader, for insulating, the generation of charges between the semiconductor chip and the heat spreader can be sharply reduced, and defects such as ESD (electrostatic discharge) can be reduced when testing for the ESD and mounting the package.

1. A high power ball grid array package comprising:
 a printed circuit board having a through hole at its center, the printed circuit board comprising a substrate, and connection pads on the substrate at one side of the printed circuit board; 
 a matrix of solder balls disposed on the printed circuit board at the one side thereof, and surrounding the through hole and the connection pads of the printed circuit board; 
 a heat spreader disposed on the other side of the printed circuit board; 
 a semiconductor chip mounted to the heat spreader, and including a plurality of bonding pads; 
 bonding wires bonding the bonding pads of the semiconductor chip to the connection pads; and 
 a passive film filling the through hole at the center of the printed circuit board, 
 wherein the heat spreader comprises:
 a chip supporting body to which the semiconductor chip is adhered; 
 a ceramic film disposed on the chip supporting body; 
 a first metal layer disposed on one surface of the ceramic film; 
 a second metal layer disposed on the other surface of the ceramic film and interposed between the ceramic film and the printed circuit board, the second metal layer having a through hole, the chip supporting body being disposed within the through hole of the second metal layer so as to be surrounded by the second metal layer, the chip supporting body being mounted to the ceramic film, and wherein the semiconductor chip is electrically isolated from the metal layers of the heat spreader; and 
 a protection layer disposed on the second metal layer and protecting the second metal layer. 
 
 
     
     
       2. The high power ball grid array package of  claim 1 , wherein the ceramic film is composed of at least one of AIN, BeO, and Al 2 O 3 . 
     
     
       3. The high power ball grid array package of  claim 1 , wherein each of the metal layers is composed of one of copper and a copper alloy. 
     
     
       4. The high power ball grid array package of  claim 1 , wherein the protection layer is composed of nickel. 
     
     
       5. The high power ball grid array package of  claim 4 , wherein the protection layer is a plating on a surface of the second metal layer. 
     
     
       6. A heat spreader for a high-power ball grid array package, the heat spreader comprising:
 a board comprising a supporting main body having an upper surface and a bottom surface and composed of a ceramic, an upper metal layer disposed on the upper surface of the supporting main body so as to emit heat transferred thereto from the supporting main body, and a protection layer disposed on the upper metal layer such that upper metal layer is interposed between the supporting main body and the protection layer; and 
 a lower metal layer disposed on the bottom surface of the supporting main body, and having a through hole at its center such that the lower metal layer surrounds a region at which a semiconductor chip can be mounted to the heat spreader, whereby the lower metal layer will absorb heat radiating from a chip attached to the heat spreader within the through hole. 
 
     
     
       7. The heat spreader of  claim 6 , wherein the supporting main body comprise one of AIN, BeO, and Al 2 O 3 . 
     
     
       8. The heat spreader of  claim 6 , wherein the upper metal layer and the lower metal layer are each composed of one of copper and a copper alloy. 
     
     
       9. The heat spreader of  claim 6 , wherein the protection layer is composed of one of nickel and a nickel alloy. 
     
     
       10. The heat spreader of  claim 9 , wherein the protection layer is a plating of nickel or a nickel alloy on a surface of the upper metal layer.