Method of manufacturing a light emitting device

Abstract

A light emitting device having excellent thermal resistance and light resistance is provided. The light emitting device is manufactured by disposing a substrate electrode having a predetermined conductive pattern provided thereon to a substrate of a ceramic; flip-chip mounting a light emitting element having an n-side electrode and a p-side electrode on a common surface side onto the substrate electrode in a face-down manner and electrically connecting thereto; heating a glass to a temperature from the glass transition temperature to below the melting point of the glass, until the glass shows its softened state; and fixing the softened glass to the substrate by way of pressing to cover the light emitting element with the glass.

1. A manufacturing method for a light emitting device comprising the steps of:
 mounting a light emitting element having a pair of positive and negative electrodes on a substrate having a substrate electrode, and electrically connecting the electrodes of the light emitting element with the substrate electrode; 
 heating an encapsulating member to a temperature from a glass transition temperature to below a melting point of the encapsulating member; 
 pressing the encapsulating member against the substrate having the light emitting element mounted thereon by contacting with a mold having a predetermined shape so as to apply pressure; 
 cooling the encapsulating member; and 
 polishing an upper surface of the encapsulating member. 
 
     
     
       2. The manufacturing method for a light emitting device according to  claim 1 , further comprising the step of: cutting or polishing a side surface of the encapsulating member. 
     
     
       3. The manufacturing method for a light emitting device according to  claim 1 , wherein said step of heating an encapsulating member includes heating to a temperature from 200° C. to 800° C. 
     
     
       4. The manufacturing method for a light emitting device according to  claim 1 , further comprising the step of: contacting a mold having a predetermined shape with the encapsulating member so as to apply pressure in said step of pressing. 
     
     
       5. The manufacturing method for a light emitting device according to  claim 1 , further comprising the step of: disposing a protective element on a side opposite to a side where the light emitting element is mounted. 
     
     
       6. The manufacturing method for a light emitting device according to  claim 1 , further comprising the step of: disposing a coating on a surface of the encapsulating member. 
     
     
       7. The manufacturing method for a light emitting device according to  claim 1 , wherein said step of heating an encapsulating member includes using a glass material selected from the group consisting of SiO 2 , B 2 O 3 , ZnO, and TiO 2 . 
     
     
       8. The manufacturing method for a light emitting device according to  claim 1 ,wherein said step of heating an encapsulating member includes using PbO in a glass material selected from the group consisting of SiO 2 , B 2 O 3 , ZnO, and TiO 2 . 
     
     
       9. A manufacturing method for a light emitting device comprising the steps of:
 mounting a light emitting element having a pair of positive and negative electrodes on a substrate having a substrate electrode, and electrically connecting the electrodes of the light emitting element with the substrate electrode; 
 heating an encapsulating member, which is a lead glass, to a temperature from a glass transition temperature of 300° C. to 700° C. to below a melting point of the lead glass; 
 pressing the encapsulating member against the substrate having the light emitting element mounted thereon by contacting with a mold having a predetermined shape so as to apply pressure; and 
 cooling the encapsulating member. 
 
     
     
       10. A manufacturing method for a light emitting device comprising the steps of:
 mounting a light emitting element having a pair of positive and negative electrodes on a substrate having a substrate electrode, and electrically connecting the electrodes of the light emitting element with the substrate electrode; 
 heating an encapsulating member to a temperature from a glass transition temperature to below a melting point of the encapsulating member; 
 pressing the encapsulating member against the substrate having the light emitting element mounted thereon by contacting with a mold having a predetermined shape so as to apply pressure; 
 cooling the encapsulating member; 
 disposing a coating on a surface of the encapsulating member; 
 polishing an upper surface of the encapsulating member; and 
 cutting or polishing a side surface of the encapsulating member.