Universal blank for air flow management

Abstract

A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.

1. A blank for managing air flow through a body of an information handling system, the blank comprising:
 a blank base plate configured to match an architecture of both a processor socket and a bank of memory chip sockets; and 
 a blank ridge extending from the base plate; 
 wherein the blank is configured to provide an impedance to air flow substantially similar to a total impedance provided by (a) a processor and associated heat sink disposed in the processor socket and (b) a bank of memory chips disposed in the bank of memory chip sockets. 
 
     
     
       2. A blank according to  claim 1 , wherein the bank of memory chip sockets include dual in-line memory module sockets. 
     
     
       3. A blank according to  claim 1 , wherein the processor socket includes a zero insertion force socket. 
     
     
       4. A blank according to  claim 1 , further comprising a connector configured to mate with a lever associated with the processor socket and retain the blank in place against the processor socket. 
     
     
       5. A blank according to  claim 1 , wherein the blank base plate is configured to rest on top of the processor socket and the bank of memory chip sockets. 
     
     
       6. A blank according to  claim 1 , wherein the blank ridge is configured to allow a stack of multiple blanks. 
     
     
       7. An information handling system comprising:
 a motherboard having multiple processor configurations; 
 a first processor socket having an associated first memory bank; 
 a processor installed in the first processor socket, the processor having an associated heat sink; 
 a second processor socket having an associated second memory bank; and 
 a blank comprising:
 a base plate configured to match the architecture of both the second processor socket and the second memory bank; and 
 a ridge extending from the base plate; 
 wherein the ridge is tuned to provide substantially the same impedance to air flow as the combination of the first processor, the first heat sink, and the first memory bank. 
 
 
     
     
       8. An information handling system according to  claim 7 , wherein the first memory bank includes a dual in-line memory module. 
     
     
       9. An information handling system according to  claim 7 , wherein the second processor socket includes a zero insertion force socket. 
     
     
       10. An information handling system according to  claim 7 , wherein the blank further comprises a connector configured to mate with a lever associated with the second processor socket and retain the blank in place against the second processor socket. 
     
     
       11. An information handling system according to  claim 7 , wherein the blank base plate is configured to rest on top of the processor socket and the bank of memory chip sockets. 
     
     
       12. An information handling system according to  claim 7 , wherein the blank ridge is configured to allow a stack of multiple blanks. 
     
     
       13. A method for managing air flow through the body of an information handling system, the method comprising:
 assessing the air flow through a memory bank and one or more heat sinks populated on a motherboard; 
 comparing the assessed airflow with airflow through a blank; and 
 tuning the blank to match the airflow through the blank to the assessed airflow. 
 
     
     
       14. A method according to  claim 13 , further comprising installing the blank in the information handling system. 
     
     
       15. A method according to  claim 13 , further comprising installing the blank in the information handling system opposite the memory bank and the one or more heat sinks populated on the motherboard. 
     
     
       16. A method according to  claim 13 , further comprising installing the blank to cover an unpopulated processor socket and an unpopulated bank of memory sockets. 
     
     
       17. A method according to  claim 13 , wherein the one or more heat sinks are associated with a central processing unit populated on a motherboard. 
     
     
       18. A method according to  claim 13 , wherein the memory bank includes one or more DIMMs. 
     
     
       19. A method according to  claim 13 , wherein the blank includes a blank base plate configured to rest on top of a processor socket and a bank of memory sockets. 
     
     
       20. A method according to  claim 13 , further comprising configuring the blank to include a blank ridge allowing a stack of multiple blanks.