P
US7907410B2ActiveUtilityPatentIndex 84

Universal patterned metal thermal interface

Assignee: IBMPriority: Nov 8, 2007Filed: Nov 8, 2007Granted: Mar 15, 2011
Est. expiryNov 8, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Inventors:MARTIN YVES CVAN KESSEL THEODORE G
H10W 40/258H10W 40/251H10W 40/22
84
PatentIndex Score
10
Cited by
22
References
15
Claims

Abstract

The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid.

Claims

exact text as granted — not AI-modified
1. A thermal interface for coupling a first solid to a second solid, the thermal interface comprising:
 a patterned metal insert having a first exterior side positioned to contact the first solid and a second exterior side positioned to contact the second solid; 
 a corrosion resistant layer coated directly onto at least one of the first exterior side and the second exterior side prior to the thermal interface being deployed between the first solid and the second solid, for protecting the patterned metal insert from corrosion, a metallic bond coupling the corrosion resistant layer to the patterned metal insert; and 
 an organic layer coated directly onto the corrosion resistant layer prior to the thermal interface being deployed between the first solid and the second solid, for facilitating bonding of the patterned metal insert to one of the first solid and the second solid; 
 wherein the at least one of the first exterior side and the second exterior side that is coated by the corrosion resistant layer is unpatterned, and 
 wherein an interior volume of the patterned metal insert is patterned. 
 
     
     
       2. The thermal interface of  claim 1 , wherein the patterned metal insert is patterned on one of the first exterior side and the second exterior side. 
     
     
       3. The thermal interface of  claim 1 , wherein the interior volume comprises a plurality of inclusions. 
     
     
       4. The thermal interface of  claim 3 , wherein the inclusions comprise at least one of: a gas, a polymer, a shell filled with a gas, a shell filled with a polymer, or a rubber-like material. 
     
     
       5. The thermal interface of  claim 1 , wherein the patterned metal insert comprises at least one of: a metal foil, a metal mesh, or a perforated metal sheet. 
     
     
       6. The thermal interface of  claim 1 , wherein the patterned metal insert comprises at least one of: indium, tin, indium-tin, lead, gold, silver, bismuth, antimony, thallium or gallium. 
     
     
       7. The thermal interface of  claim 1 , wherein the corrosion resistant layer comprises at least one of: titanium, tantalum, tungsten, nickel, gold, or platinum. 
     
     
       8. The thermal interface of  claim 1 , wherein the organic layer comprises at least one of: an adhesive, a polymer, an oil, a wax, or a paraffin. 
     
     
       9. The thermal interface of  claim 1 , wherein the first exterior side and the second exterior side define an outer boundary of the patterned metal insert. 
     
     
       10. The thermal interface of  claim 1 , wherein the patterned metal insert comprises an array of metal lumps held together by an organic binder. 
     
     
       11. The thermal interface of  claim 1 , wherein the patterned metal insert, the corrosion resistant layer, and the organic layer together comprise a unitary structure that is removable as a whole from between the first solid and the second solid. 
     
     
       12. The thermal interface of  claim 1 , wherein the corrosion resistant layer is formed from a material that is more noble than a material from which the patterned metal insert is formed. 
     
     
       13. A method for coupling a first solid to a second solid using a thermal interface, the method comprising:
 positioning the thermal interface between a first surface of the first solid and a first surface of the second solid, the thermal interface comprising: a patterned metal insert having a first exterior side positioned to contact the first solid and a second exterior side positioned to contact the second solid; 
 metallic bonding a corrosion resistant layer coated directly onto at least one of the first exterior side and the second exterior side of the patterned metal insert prior to the positioning, for protecting the patterned metal insert from corrosion; and 
 an organic layer coated directly onto the corrosion resistant layer prior to the positioning, for facilitating bonding of the patterned metal insert to one of the first solid and the second solid; and 
 compressing the thermal interface between the first surface of the first solid and the first surface of the second solid such that the patterned metal insert deforms; 
 wherein the at least one of the first exterior side and the second exterior side that is coated by the corrosion resistant layer is unpatterned, and 
 wherein an interior volume of the patterned metal insert is patterned. 
 
     
     
       14. The method of  claim 13 , wherein the first solid is a heat generating device, and the second solid is a heat sink. 
     
     
       15. The method of  claim 13 , wherein the patterned metal insert, the corrosion resistant layer, and the organic layer are pre-assembled as the thermal interface prior to the positioning.

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