Layer system, use and process for producing a layer system

Abstract

Layered systems, which are used at high temperatures, often degrade rapidly when a layer has been lost, leading to the damage or loss of the component that consists of said layered system. A described layered system comprises at least one cooling safety orifice, which is e.g. covered by an intermediate layer and an outer layer. The cooling safety orifice opens if the layers are damaged, in such a way that the layered system is additionally cooled by a coolant that flows through the cooling safety orifice.

1. A method for producing a layer system, comprising:
 introducing a masking agent in a first plurality of safety cooling holes,
 wherein the first plurality of safety cooling holes are in a substrate or in the substrate and an intermediate layer, and 
 wherein the intermediate layer is deposited on or over the masking agent; 
 
 introducing a nonstick masking agent into a second plurality of safety holes in order to prevent the intermediate layer from being deposited over the nonstick masking agent; 
 applying the intermediate layer to a surface of a device with the substrate and the first plurality of safety cooling holes, wherein the intermediate layer is applied over the filled first plurality of safety cooling holes to cover the first plurality of safety cooling holes; and 
 removing the masking agent and the non-stick masking agent after the coating, wherein the applied intermediate layer stays to close the first plurality of safety cooling holes. 
 
     
     
       2. The method as claimed in  claim 1 , wherein the device is an airfoil, and wherein the airfoil is selected from the group consisting of a turbine blade and a vane. 
     
     
       3. The method as claimed in  claim 1 ,
 wherein the safety cooling holes extend through the substrate and the intermediate layer, 
 wherein the nonstick masking agent is introduced into a cooling hole that remains open, and 
 wherein a further layer is applied to the intermediate layer to cover the safety cooling holes. 
 
     
     
       4. The method as claimed in  claim 3 , wherein the further layer is an outer layer of the device.