P
US7916479B2ActiveUtilityPatentIndex 63

Heat dissipating system and connector thereof

Assignee: HONGFUJIN PREC IND SHENZHENPriority: Jun 5, 2009Filed: Jun 25, 2009Granted: Mar 29, 2011
Est. expiryJun 5, 2029(~2.9 yrs left)· nominal 20-yr term from priority
Inventors:SUN ZHENG-HENGMa xiao-feng
G06F 1/181G06F 1/20
63
PatentIndex Score
5
Cited by
18
References
5
Claims

Abstract

A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.

Claims

exact text as granted — not AI-modified
1. A heat dissipating system for a plurality of external cards, the heat dissipating system comprising:
 a chassis; 
 a motherboard mounted in the chassis; 
 a plurality of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, each of the connectors comprising: 
 a socket defining a slot to accommodate a bottom of a corresponding external card; and 
 two opposite inserting portions extending up from two opposite ends of the socket, each inserting portion comprising: 
 a main body; and 
 a protrusion extending from the main body towards the slot, wherein a cross-section of the protrusion is trapezoidal-shaped, at least one of two side surfaces of the protrusion is inclined and extends from at least one of two side surfaces of the main body towards the slot and the opposite inserting portion to form an airflow guiding structure which guides airflow toward the corresponding external card plugged in the slot; and 
 a heat dissipating element mounted on the chassis and aligned with the passages. 
 
     
     
       2. The heat dissipating system of  claim 1 , wherein the plurality of connectors is at least a memory card connector. 
     
     
       3. The heat dissipating system of  claim 1 , wherein the heat dissipating element is a fan. 
     
     
       4. A connector to be mounted on a motherboard, the connector comprising:
 a socket defining a slot; and 
 two opposite inserting portions extending upward from two opposite ends of the socket, each inserting portion comprising: 
 a main body; and 
 a protrusion extending from the main body towards the slot, wherein a cross-section of the protrusion is trapezoidal-shaped, at least one side surface of the protrusion is inclined and extends from at least one of two side surfaces of the main body towards the slot and the opposite inserting portion to form an airflow guiding structure which guides airflow toward a card plugged in the slot. 
 
     
     
       5. The connector of  claim 4 , wherein the connector is a memory card connector.

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