Resin molding apparatus and resin molding method

Abstract

Disclosed is a resin molding apparatus capable of enhancing transfer accuracy, reducing the cost of a molding apparatus, and shortening a molding cycle. The resin molding apparatus includes a first mold; a second mold disposed in opposition to the first mold; a transfer plate ( 34 ) attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity (C 1 , C 2 ); and a thermal insulation layer ( 40 ) disposed between the transfer plate ( 34 ) and the one of the first and second molds and formed through growth from the transfer plate ( 34 ) side or from the one of the first and second mold sides. Being disposed between the transfer plate ( 34 ) and the one of the first and second molds, the thermal insulation layer ( 40 ) can restrain dissipation of thermal energy of a molding material toward the mold. This can restrain formation of a skin layer, which would otherwise result from a sharp drop in temperature of the molding material, whereby transfer accuracy can be enhanced.

1. A resin molding method of a resin molding apparatus comprising a first mold, a second mold disposed in opposition to the first mold, a transfer plate attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity, and a thermal insulation layer comprising a honeycomb structure and disposed between the transfer plate and the one of the first and second molds and formed through growth from the transfer plate side or from the one of the first and second mold sides, a honeycomb pitch of the honeycomb structure being 0.1 μm to 100 μm inclusive, comprising:
 (a) charging a molding material into the cavity and transferring the pattern onto the molding material, and 
 (b) after transfer of the pattern, applying a mold-clamping force so as to plastically deform a portion of the molding material in the vicinity of the transfer surface. 
 
     
     
       2. A resin molding method of a resin molding apparatus comprising a first mold, a second mold disposed in opposition to the first mold, a transfer plate attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity, and a thermal insulation layer comprising a honeycomb structure and disposed between the transfer plate and the one of the first and second molds and formed through growth from the transfer plate side or from the one of the first and second mold sides, a wall thickness of the honeycomb structure being 0.01 μm to 10 μm inclusive, comprising:
 (a) charging a molding material into the cavity and transferring the pattern onto the molding material, and 
 (b) after transfer of the pattern, applying a mold-clamping force so as to plastically deform a portion of the molding material in the vicinity of the transfer surface. 
 
     
     
       3. A resin molding apparatus comprising:
 (a) a first mold; 
 (b) a second mold disposed in opposition to the first mold; 
 (c) a transfer plate attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity; and 
 (d) a thermal insulation layer comprising a honeycomb structure and disposed between the transfer plate and the one of the first and second molds and formed through growth from the transfer plate side or from the one of the first and second mold sides, wherein 
 (e) a honeycomb pitch of the honeycomb structure is 0.1 μm to 100 μm inclusive. 
 
     
     
       4. A resin molding apparatus according to  claim 3 , wherein the thermal insulation layer is formed through growth from the transfer plate side. 
     
     
       5. A resin molding apparatus according to  claim 3 , wherein the thermal insulation layer is formed through growth from the one of the first and second molds. 
     
     
       6. A resin molding apparatus according to  claim 3 , wherein a honeycomb height of the honeycomb structure is 10 μm to 10 mm inclusive. 
     
     
       7. A resin molding apparatus according to  claim 3 , wherein the thermal insulation layer comprises a stack of honeycomb structures. 
     
     
       8. A resin molding apparatus according to  claim 3 , wherein the temperature of the one of the first and second molds as measured when molding is started is set 50° C. or more lower than a glass transition temperature of a molding material. 
     
     
       9. A resin molding apparatus comprising:
 (a) a first mold; 
 (b) a second mold disposed in opposition to the first mold; 
 (c) a transfer plate attached to one of the first and second molds and comprising a transfer surface bearing a pattern of pits and projections and oriented toward a cavity; and 
 (d) a thermal insulation layer comprising a honeycomb structure and disposed between the transfer plate and the one of the first and second molds and formed through growth from the transfer plate side or from the one of the first and second mold sides, wherein 
 (e) a wall thickness of the honeycomb structure is 0.01 μm to 10 μm inclusive. 
 
     
     
       10. A resin molding apparatus according to  claim 9 , wherein the thermal insulation layer is formed through growth from the transfer plate side. 
     
     
       11. A resin molding apparatus according to  claim 9 , wherein the thermal insulation layer is formed through growth from the one of the first and second molds. 
     
     
       12. A resin molding apparatus according to  claim 9 , wherein a honeycomb height of the honeycomb structure is 10 μm to 10 mm inclusive. 
     
     
       13. A resin molding apparatus according to  claim 9 , wherein the thermal insulation layer comprises a stack of honeycomb structures. 
     
     
       14. A resin molding apparatus according to  claim 9 , wherein the temperature of the one of the first and second molds as measured when molding is started is set 50° C. or more lower than a glass transition temperature of a molding material.