Heat dissipation structure for communication chassis

Abstract

A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.

1. A heat dissipation structure for a communication chassis, comprising an enclosure, the enclosure including a first copper heat absorption component and a first heat pipe assembly, the first copper heat absorption component and the first heat pipe assembly being disposed in the enclosure, the first heat pipe assembly being connected to the first copper heat absorption component and the first heat pipe assembly having a section not in contact with the first copper heat absorption component, whereby the first heat pipe assembly transfers heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat and wherein the first copper heat absorption component has a first end face flush with an inner surface of a bottom face of the enclosure and a second end face embedded in the bottom face of the enclosure, the first copper heat absorption component being integrally formed with the enclosure, and wherein the first copper heat absorption component in contact with and adjacent to at least one heat-generating component to form a hot area. 
     
     
       2. The heat dissipation structure for the communication chassis as claimed in  claim 1 , wherein the enclosure defines a receiving space. 
     
     
       3. The heat dissipation structure for the communication chassis as claimed in  claim 2 , wherein the enclosure includes a first heat dissipation section, a second heat dissipation section, a third heat dissipation section, a fourth heat dissipation section and a fifth heat dissipation section, which communicate with each other to form a cold area, the first heat dissipation section being disposed on the bottom face of the receiving space and distal from the first copper heat absorption component, the second, third, fourth and fifth heat dissipation sections being disposed on a periphery of the receiving space in communication with each other. 
     
     
       4. The heat dissipation structure for the communication chassis as claimed in  claim 2 , wherein at least one chassis board is rested in the receiving space, the at least one heat-generating component being disposed on the at least one chassis board. 
     
     
       5. The heat dissipation structure for the communication chassis as claimed in  claim 4 , further comprising at least one support element and at least one heat conduction element, the at least one support element being disposed in the receiving space of the enclosure for supporting the at least one chassis board, and the at least one heat conduction element having at least one second copper heat absorption component, which abuts against the at least one heat-generating component of a chassis board of the at least one chassis board to form the hot area. 
     
     
       6. The heat dissipation structure for the communication chassis as claimed in  claim 5 , wherein two opposite end faces of the at least one second copper heat absorption component are flush with surfaces of the at least one heat conduction element and the at least one second copper heat absorption component is integrally formed with the at least one heat conduction element. 
     
     
       7. The heat dissipation structure for the communication chassis as claimed in  claim 5 , wherein the at least one heat conduction element includes a second heat pipe assembly, the second heat pipe assembly including multiple second heat pipes each having a second heat absorption end adjacent to the at least one second copper heat absorption component and a second heat dissipation end distal from the at least one second copper heat absorption component, whereby each of the second heat absorption ends absorbs the heat and transfers the heat through each of the second heat dissipation ends to the section not in contact with the first copper heat absorption component to dissipate the heat. 
     
     
       8. The heat dissipation structure for the communication chassis as claimed in  claim 2 , wherein the enclosure has multiple radiating fins disposed on an outer surface of the bottom face of the enclosure opposite to the receiving space. 
     
     
       9. The heat dissipation structure for the communication chassis as claimed in  claim 2 , wherein the enclosure is mated with a cover body having a first face facing the receiving space, a third copper heat absorption component being disposed on the first face of the cover body, the cover body further having a second face opposite to the first face, multiple radiating fins being disposed on the second face of the cover body, the third copper heat absorption component abutting against the at least one heat-generating component to form the hot area. 
     
     
       10. The heat dissipation structure for the communication chassis as claimed in  claim 9 , wherein a surface of the third copper heat absorption component is flush with the first face of the cover body and the third copper heat absorption component is integrally formed with the cover body. 
     
     
       11. The heat dissipation structure for the communication chassis as claimed in  claim 9 , wherein the cover body has a third heat pipe assembly, the third heat pipe assembly including multiple third heat pipes each having a third heat absorption end adjacent to the third copper heat absorption component and a third heat dissipation end distal from the third copper heat absorption component, each of the third heat absorption ends absorbs the heat and transfers the heat through each of the third heat dissipation ends to the section not in contact with the first copper heat absorption component to dissipate the heat. 
     
     
       12. The heat dissipation structure for the communication chassis as claimed in  claim 9 , wherein the cover body has a third heat pipe assembly, the third heat pipe assembly including multiple third heat pipes each having a third heat absorption end adjacent to the third copper heat absorption component and a third heat dissipation end distal from the third copper heat absorption component, each of the third heat absorption ends absorbing the heat and transferring the heat through each of the third heat dissipation ends to one of the radiating fins of the cover body and the section of the first heat pipe not in contact with the first copper heat absorption component to dissipate the heat. 
     
     
       13. The heat dissipation structure for the communication chassis as claimed in  claim 1 , wherein the first heat pipe assembly includes multiple first heat pipes each having a first heat absorption end and a first heat dissipation end, each of the first heat absorption ends being adjacent to the first copper heat absorption component, and each of the first heat dissipation ends being distal from the first copper heat absorption component. 
     
     
       14. The heat dissipation structure for the communication chassis as claimed in  claim 1 , wherein the enclosure has at least one recess formed in the bottom face of the enclosure for accommodating the first heat pipe assembly, a first part of the at least one recess being adjacent to the first copper heat absorption component, and a second part of the at least one recess being adjacent to the section not in contact with the first copper heat absorption component and the second part of the at least one recess being adjacent to a periphery of the enclosure. 
     
     
       15. The heat dissipation structure for the communication chassis as claimed in  claim 1 , wherein the enclosure defines a receiving space, at least one chassis board being rested in the receiving space, the at least one heat-generating component being disposed on the at least one chassis board.