Non-aqueous, non-corrosive microelectronic cleaning compositions

Abstract

Back end photoresist strippers and cleaning compositions of this invention are provided by amino acid-free, non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor compound with multiple hydroxyl functional groups that is a compound of the formula: T 1 -[(CR 1 R 2 ) m —(CR 3 R 4 ) n ] p —(CR 5 R 6 ) q -T 2 where at least one of R 1 and R 2 OH and if one of R 1 and R 2 is not OH, it is selected from H, alkyl or alkoxy, m is a whole integer of 1 or greater, R 3 and R 4 are selected from H, alkyl or alkoxy, n is 0 or a greater whole positive integer, p is a whole integer of 1 or greater; at least one of R 5 and R 6 is OH and if one of R 5 and R 6 is not OH, it is selected from H, alkyl or alkoxy, q is a whole integer of 1 or greater; T 1 and T 2 are selected from H, alkyl, hydroxyalkyl, polyhydroxyalkyl, aminoalkyl, carbonylalkyl or amide groups or T 1 and T 2 may be connected forming a structure selected from an aliphatic cyclic or fused cyclic structure.

1. An amino acid-free, non-aqueous cleaning composition for cleaning photoresist and residues from microelectronic substrates, the composition consisting of N-methyl pyrrolidone, dimethyl sulfoxide, monoisopropanolamine and D-sorbitol and wherein the N-methyl pyrrolidone and dimethyl sulfoxide components together consist of from about 60% to about 90% by weight of the composition, the monoisopropanolamine component consists of from about 3% to about 12% by weight of the composition and the D-sorbitol component consists of from about 1% to about 12% by weight of the composition. 
     
     
       2. A process for cleaning photoresist or residue from a microelectronic substrate, the process comprising contacting the substrate with a cleaning composition for a time sufficient to clean the photoresist or residue from the substrate, wherein the cleaning composition comprises a composition of  claim 1 . 
     
     
       3. A process according to  claim 2  wherein the microelectronic substrate to be cleaned is characterized by the presence of copper metallization.