Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components

Abstract

A metal film containing Ni as a main component and Mn and at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table includes a central part and a peripheral part in which Mn and the element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table are present in a concentration higher in the peripheral part than that in the central part. The metal film used as a conductor layer can have an increased melting point at the peripheral part and thus can be prevented from shrinking during heating. The metal film used as a conductor layer in electronic components and the like can be prevented from plastically deforming or shrinking during heating so that the conductor layer can have a large effective area and high adhesion to ceramic layers.

1. A metal film, comprising:
 Ni; 
 Mn; and 
 at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table, 
 wherein a total concentration, expressed by mass %, of Mn and the at least one element in the peripheral part of the metal film is 1.05 to 3 times that in a central part of the metal film. 
 
     
     
       2. The metal film according to  claim 1 , wherein the at least one element is selected from sulfur, boron and phosphorus. 
     
     
       3. A laminated electronic component, comprising:
 an electronic component body comprising alternately laminated ceramic layers and conductor layers, each of the conductor layers comprising the metal film according to  claim 1 . 
 
     
     
       4. A metal film, comprising:
 Ni; 
 Mn; and 
 at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table, 
 wherein a total concentration, expressed by mass %, of Mn and the at least one element in a peripheral part of the metal film is higher than that in the central part of the metal film, and 
 wherein a Mn content of the metal film overall is 2×10 −1 % by mass to 5% by mass in the metal film. 
 
     
     
       5. The metal film according to  claim 4 , wherein the at least one element is selected from sulfur, boron and phosphorus. 
     
     
       6. A laminated electronic component, comprising:
 an electronic component body comprising alternately laminated ceramic layers and conductor layers, each of the conductor layers comprising the metal film according to  claim 4 . 
 
     
     
       7. A metal film, comprising:
 Ni; 
 Mn; and 
 at least one element selected from the group consisting of the elements of Groups 3b, 4b, 5b, and 6b of the periodic table, 
 wherein a total concentration, expressed by mass %, of Mn and the at least one element in a peripheral part of the metal film is higher than that in a central part of the metal film, and 
 wherein a content of the at least one element of the metal film overall is 1×10 −1 % by mass to 3×10 −1 % by mass in the metal film. 
 
     
     
       8. The metal film according to  claim 7 , wherein the at least one element is selected from sulfur, boron and phosphorus. 
     
     
       9. A laminated electronic component, comprising:
 an electronic component body comprising alternately laminated ceramic layers and conductor layers, each of the conductor layers comprising the metal film according to  claim 7 .