US7973403B2ExpiredUtilityPatentIndex 51
Adhesive sheet for light-emitting diode device and light-emitting diode device
Est. expiryFeb 2, 2024(expired)· nominal 20-yr term from priority
H10W 70/682H10H 20/85C08L 2666/02C08G 59/18C09J 163/00
51
PatentIndex Score
1
Cited by
13
References
3
Claims
Abstract
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.
Claims
exact text as granted — not AI-modified1. A light-emitting diode device comprising a light-emitting diode element, a circuit board, a fluorescent material-containing resin, a lens and a fluorescent material-containing resin sealing frame, wherein said circuit board is adhered to the sealing frame by an adhesive sheet comprising
the reaction product of a mixture of a thermoplastic polymer containing epoxy groups,
a thermoplastic polymer which contains no epoxy group, and
a compound containing functional groups which are addition reactive with epoxy groups,
wherein said mixture is cross-linked by an irradiation of an electron ray so that its flowability is restrained,
wherein the thermoplastic polymer which contains no epoxy groups comprises a thermoplastic polymer obtained by copolymerization of at least two different vinyl-group containing monomers, wherein the vinyl-group containing monomers do not contain epoxy groups.
2. The light-emitting diode device of claim 1 , wherein said thermoplastic polymer containing epoxy groups is a polyolefinic copolymer containing epoxy groups.
3. The light-emitting diode device of claim 1 , wherein said thermoplastic polymer containing epoxy groups is obtained by copolymerizing a vinyl group-containing monomer with an epoxy groups-containing monomer which is copolymerizable with said vinyl group-containing monomer.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.