Light emitting device and method for manufacturing the same

Abstract

A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.

1. A light-emitting device comprising:
 a base having an upper surface including a conductive pattern; 
 a light-emitting chip mounted on the conductive pattern and having a side surface; 
 a transparent material layer disposed on the upper surface of the base to surround the light-emitting chip and having an inner surface to face the side surface of the light-emitting chip, the inner surface being sloped so that a distance between the side surface and the inner surface facing the side surface increases as the inner surface is extended away from the upper surface of the base; 
 an intermediate layer disposed between the side surface of the light-emitting chip and the inner surface of the transparent material layer to contact the side surface of the light-emitting chip and having a refractive index larger than a refractive index of the transparent material layer; and 
 an encapsulating layer provided on an upper surface of the transparent material layer and an upper surface of the light-emitting chip to contact the upper surface of the transparent material layer and the upper surface of the light-emitting chip, the encapsulating layer having a refractive index smaller than a refractive index of the intermediate layer. 
 
     
     
       2. The light-emitting device according to  claim 1 , wherein the light-emitting chip is mounted on the conductive pattern by flip-chip bonding.