Thermosetting resin composition

Abstract

Disclosed is a thermosetting resin composition of excellent low-temperature curability comprising an oxetane compound and also disclosed is a cured article obtained therefrom. The thermosetting resin composition comprises an oxetane compound (A) containing two or more oxetane functional groups in the molecule represented by the following general formula (1) and a heteropolyacid (B) as essential components. A cured article obtained by heat curing of this composition shows excellent mechanical properties, electrical properties, adhesive properties, resistance to heat, moisture, and chemicals, and the like. In formula (1), R 1 is a hydrogen atom, alkyl group of 1 to 6 carbon atoms, fluorine atom, fluoroalkyl group of 1 to 6 carbon atoms, allyl group, aryl group, aralkyl group, furyl group, or thienyl group.

1. A thermosetting resin composition comprising an oxetane compound (A) containing two or more oxetane groups represented by the following general formula (1) in the molecule and a heteropolyacid (B) incorporated at a rate of 0.01 to 5 parts by weight to 100 parts by weight of an oxetane compound; 
       
         
           
           
               
               
           
         
       
       in formula (1), R 1  is a hydrogen atom, alkyl group of 1 to 6 carbon atoms, fluorine atom, fluoroalkyl group of 1 to 6 carbon atoms, allyl group, aryl group, aralkyl group, furyl group, or thienyl group. 
     
     
       2. A thermosetting resin composition as described in  claim 1  wherein the heteropolyacid is phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, or silicomolybdic acid, or a mixture thereof. 
     
     
       3. A process for producing a cured resin which comprises heating the thermosetting resin composition described in  claim 1  in the state of solution or in the molten state at a temperature in the range of 50 to 300° C. to effect heat curing. 
     
     
       4. A cured resin obtained by heat curing of the thermosetting resin composition described in  claim 1 . 
     
     
       5. A thermosetting resin composition as described in  claim 1  wherein the thermosetting resin existing in the thermosetting resin composition consists of only an oxetane compound containing an oxetane functional group. 
     
     
       6. A process for producing a cured resin which comprises heating the thermosetting resin composition described in  claim 2  in the state of solution or in the molten state at a temperature in the range of 50 to 300° C. to effect heat curing. 
     
     
       7. A cured resin obtained by heat curing of the thermosetting resin composition described in  claim 2 . 
     
     
       8. A thermosetting resin composition as described in  claim 2  wherein the thermosetting resin existing in the thermosetting resin composition consists of only an oxetane compound containing an oxetane functional group.