Method for manufacture of piezoelectric substrate for a saw device

Abstract

The present invention provides a composite structure having a supporting substrate between a piezoelectric substrate and a compensation layer. The materials used to form the piezoelectric substrate and the compensation layer in isolation, have higher thermal coefficients of expansion (TCE) relative to the TCE of the materials forming the supporting substrate. Once the composite structure is created, the piezoelectric substrate and compensation layer tend to expand and contract in a similar manner as temperature changes. The expansion and contraction forces applied to the supporting substrate by the piezoelectric substrate due to temperature changes are substantially countered by similar opposing forces applied by the compensation layer, resulting in the opposing forces substantially counteracting one another. Due to the counteraction, the composite structure resists bending or warping, reducing expansion and contraction and increasing stress of the piezoelectric substrate, and thus reducing the effective TCE and TCF of the piezoelectric substrate.

1. A method for manufacturing a composite structure comprising:
 providing a supporting substrate having a first isolated thermal coefficient of expansion (TCE) value, a first surface, and a second surface that is opposite the first surface; 
 providing a piezoelectric substrate over the first surface of the supporting substrate and having a second isolated TCE value higher than the first isolated TCE value; and 
 providing a compensation layer over the second surface of the supporting substrate to resist bending or warping of the composite structure, and having a third isolated TCE value higher than the first isolated TCE value; 
 wherein the piezoelectric substrate is attached over the first surface of the supporting substrate; and 
 wherein the compensation layer is provided over the second surface of the supporting substrate after the piezoelectric substrate is attached over the first surface of the supporting substrate. 
 
     
     
       2. The method of  claim 1  wherein the supporting substrate is formed over the piezoelectric substrate. 
     
     
       3. A method for manufacturing a composite structure comprising:
 providing a supporting substrate having a first isolated thermal coefficient of expansion (TCE) value, a first surface, and a second surface that is opposite the first surface; 
 providing a piezoelectric substrate over the first surface of the supporting substrate and having a second isolated TCE value higher than the first isolated TCE value; and 
 providing a compensation layer over the second surface of the supporting substrate to resist bending or warping of the composite structure, and having a third isolated TCE value higher than the first isolated TCE value; 
 wherein the supporting substrate is formed over the piezoelectric substrate; and 
 wherein the compensation layer is provided over the second surface of the supporting substrate after the supporting substrate is formed over the piezoelectric substrate. 
 
     
     
       4. A method for manufacturing a composite structure comprising:
 providing a supporting substrate having a first isolated thermal coefficient of expansion (TCE) value, a first surface, and a second surface that is opposite the first surface; 
 providing a piezoelectric substrate over the first surface of the supporting substrate and having a second isolated TCE value higher than the first isolated TCE value; and 
 providing a compensation layer over the second surface of the supporting substrate to resist bending or warping of the composite structure, and having a third isolated TCE value higher than the first isolated TCE value; 
 wherein the supporting substrate is formed over the piezoelectric substrate; and 
 attaching the piezoelectric substrate to a temporary carrier prior to forming the supporting substrate over the piezoelectric substrate. 
 
     
     
       5. The method of  claim 1  wherein the compensation layer is attached over the second surface of the supporting substrate. 
     
     
       6. The method of  claim 5  wherein the piezoelectric substrate is provided over the first surface of the supporting substrate after the compensation layer is attached over the second surface of the supporting substrate. 
     
     
       7. The method of  claim 1  wherein the second and third isolated TCE values are substantially similar. 
     
     
       8. The method of  claim 1  wherein the supporting substrate is formed from at least one of a group consisting of silicon, diamond, fused silica, and alumina ceramic. 
     
     
       9. The method of  claim 1  wherein the first isolated TCE value is between about −10 and 10 ppm/degree C. 
     
     
       10. The method of  claim 1  wherein the supporting substrate has a Young's Modulus between about 20 and 1200 GPa. 
     
     
       11. The method of  claim 1  wherein the piezoelectric substrate is formed from at least one of a group consisting of single crystal piezoelectric material, deposited piezoelectric thin films, and piezoceramics. 
     
     
       12. The method of  claim 1  wherein the second isolated TCE value is between about 10 and 20 ppm/degree C. 
     
     
       13. The method of  claim 1  wherein the compensation layer is formed from at least one of a group consisting of lithium tantalate, lithium niobate, steel, nickel, copper, and aluminum. 
     
     
       14. The method of  claim 1  wherein the third isolated TCE value is between about 10 and 20 ppm/degree C. 
     
     
       15. The method of  claim 1  further comprising forming interdigitated transducers over the piezoelectric substrate.