Semiconductor device and electronic component module using the same

Abstract

A semiconductor device includes a circuit board having an element mounting area, connecting pads positioned in the same surface side as the element mounting area and external connectors to be connected with the connecting pads, respectively; and a semiconductor element mounted on the element mounting area of the circuit board and having electrode pads to be electrically connected with the connecting pads, respectively. The external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another.

1. A semiconductor device, comprising:
 a circuit board having an element mounting area, connecting pads positioned in the same surface side as said element mounting area and external connectors to be connected with the said connecting pads, respectively; and 
 a semiconductor element mounted on said element mounting area of said circuit board and having electrode pads to be electrically connected with said connecting pads, respectively, 
 wherein said external connectors are detachably configured through a combination of convex portions and concave portions which are mechanically and electrically connected with one another, and 
 each of said external connectors is embedded into said circuit board and includes at least one of a convex connector corresponding to said convex portion and a concave connector corresponding to said concave portion, the convex connector having a first inverted truncated cone form having a first circular top, a first circular bottom, and a circular body which tapers, a diameter of the first circular top being larger than that of the first circular bottom, and the concave connector having a second inverted truncated cone form having a second circular top, a second circular bottom, and a circular inner side which tapers, a diameter of the second circular top being larger than that of the second circular bottom, corresponding to the first inverted truncated cone form. 
 
     
     
       2. The semiconductor device as set forth in  claim 1 , wherein said semiconductor element is a plurality of semiconductor elements which are stacked subsequently. 
     
     
       3. The semiconductor device as set forth in  claim 1 , wherein said semiconductor element is a plurality of semiconductor elements which are arranged in plane. 
     
     
       4. The semiconductor device as set forth in  claim 1 , wherein a diameter of the first circular top is larger than a diameter of the second circular bottom so that said convex connector can be electrically and mechanically connected with said concave connector by means of elastic deformation of said convex connector and said concave connector. 
     
     
       5. The semiconductor device as set forth in  claim 1 , wherein a thermal expansion coefficient of said concave connector is set larger than a thermal expansion coefficient of said convex connector so that said convex connector can be electrically and mechanically connected with said concave connector by means of the difference in thermal expansion between said convex connector and said concave connector. 
     
     
       6. The semiconductor device as set forth in  claim 5 , wherein when said thermal expansion coefficient of said convex connector is defined as α 1  and said thermal expansion coefficient of said concave is defined as α 2 , a relation of α 2 >α 1  is satisfied. 
     
     
       7. The semiconductor device as set forth in  claim 1 , wherein the larger the distance from said circuit board to a first point on an axis of the convex portion is, the larger a diameter of the convex portion at the first point is, and
 the larger the distance from said circuit board to a second point on an axis of the concave portion is, the larger a diameter of the concave portion at the second point is.