Connecting and bonding adjacent layers with nanostructures

Abstract

An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

1. An apparatus, comprising:
 a first conductive surface; 
 a second conductive surface; and 
 two or more nanostructures arranged between the first conductive surface and the second conductive surface, 
 wherein each of the two or more nanostructures is oriented parallel to another of the two or more nanostructures, 
 wherein a first bond exists between a first end of each of the two or more nanostructures and the first conductive surface, and wherein the two or more nanostructures are oriented perpendicular to the first conductive surface, 
 wherein a second bond exists between a second end of each of the two or more nanostructures and the second conductive surface, 
 wherein the two or more nanostructures are oriented perpendicular to the second conductive surface, and 
 wherein at least one of the first and second bonds has been formed by applying a compressive force on the two or more nanostructures by the first conductive surface and the second conductive surface. 
 
     
     
       2. The apparatus of  claim 1 , further comprising:
 a carrier, wherein the two or more nanostructures are embedded in the carrier. 
 
     
     
       3. The apparatus of  claim 2 , wherein the first bond and the second bond are created by curing the carrier. 
     
     
       4. The apparatus of  claim 3 , wherein curing the carrier causes the carrier to contract, thereby compressing the two or more nanostructures and creating a spring-load force that pushes the first end of each of the two or more nanostructures against the first conductive surface and pushes the second end of each of the two or more nanostructures against the second conductive surface. 
     
     
       5. The apparatus of  claim 3 , wherein at least the first end of the one or more nanostructures is maintained in contact with the first conductive surface by tensioning force exerted by the cured carrier. 
     
     
       6. The apparatus of  claim 1 , wherein the two or more nanostructures comprise two or more interdiffused materials, the two or more interdiffused materials including at least one material that affects a morphology of the two or more nanostructures and at least one material that affects an electrical property of an interface between the first conductive surface. 
     
     
       7. The apparatus of  claim 6 , wherein at least one material of the two or more interdiffused materials are selected from the group consisting of amorphous silicon and germanium. 
     
     
       8. The apparatus of  claim 1 , wherein the one or more nanostructures are deformed from the perpendicular orientation under the compressive force applied by the first conductive surface and the second conductive surface. 
     
     
       9. The apparatus of  claim 1 , wherein at least the first or second bonds has been formed by soldering. 
     
     
       10. An apparatus, comprising:
 a semiconductor device having a first conductive surface; 
 a substrate supporting the semiconductor device, the substrate having a second conductive surface; and 
 two or more nanostructures arranged between the semiconductor device and the substrate, 
 wherein each of the two or more nanostructures is oriented parallel to another of the two or more nanostructures, 
 wherein a first bond exists between a first end of each of the two or more nanostructures and the first conductive surface, and wherein the two or more nanostructures are oriented perpendicular to the first conductive surface, 
 wherein a second bond exists between a second end of each of the two or more nanostructures and the second conductive surface, 
 wherein the two or more nanostructures are oriented perpendicular to the second conductive surface, and 
 wherein at least one of the first and second bonds has been formed by applying a compressive force on the two or more nanostructures by the first conductive surface and the second conductive surface.