US8116098B2ActiveUtilityA1

Base element, base system and method for manufacturing another base system

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Assignee: HORTIG MICHAELPriority: Nov 12, 2007Filed: Nov 12, 2008Granted: Feb 14, 2012
Est. expiryNov 12, 2027(~1.3 yrs left)· nominal 20-yr term from priority
Y10T29/4998H05K 2201/10484G01C 25/00Y10T29/49826H05K 3/301H05K 2201/10151Y10T29/49117G01P 1/023H05K 2201/10325
50
PatentIndex Score
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Cited by
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References
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Claims

Abstract

A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A base element comprising:
 a first surface adapted to receive a module housing; and 
 a second surface adapted to be mounted on a carrier element, 
 wherein an angle between 0 and 90 degrees is defined between a first face normal of the first surface and a second face normal of the second surface; and 
 wherein the first surface has a first electrical connection surface for the module housing and the second surface has a second electrical connection surface for the carrier element, the first and second connection surfaces including a standardized connection surface, and the first connection surface being not identical to the second connection surface. 
 
     
     
       2. The base element according to  claim 1 , wherein the module housing and the carrier element have a first and a second main extension plane having a third and a fourth face normal, the third face normal running substantially parallel to the first face normal and the fourth face normal running substantially parallel to the second face normal. 
     
     
       3. The base element according to  claim 1 , wherein the carrier element includes at least one of (a) a circuit board, (b) a board, (c) a conductor path and (d) a plurality of conductor paths. 
     
     
       4. The base element according to  claim 1 , wherein the module housing includes an electrical, electronic and/or microelectronic component, including at least one of a micromechanical rotational speed sensor and acceleration sensor. 
     
     
       5. The base element according to  claim 1 , further comprising a spring element adapted in such a way that at least one of (a) a spring motion of the first surface parallel to the first and/or second face normals is made possible and (b) the base element has a pre-fixing edge. 
     
     
       6. The base element according to  claim 1 , further comprising a third surface having a fifth face normal, the fifth face normal running substantially parallel to the second face normal. 
     
     
       7. The base element according to  claim 1 , wherein the base element has at least one electrically conductive connection between the module housing and the carrier element and between the first and second connection surfaces. 
     
     
       8. A base system comprising:
 a module housing; and 
 a base element including: 
 a first surface adapted to receive the module housing, and 
 a second surface adapted to be mounted on a carrier element, 
 wherein an angle between 0 and 90 degrees is defined between a first face normal of the first surface and a second face normal of the second surface, 
 wherein the module housing is at least one of (a) materially, (b) frictionally and (c) positively fixed mechanically on the first surface, and 
 wherein the first surface has a first electrical connection surface for the module housing and the second surface has a second electrical connection surface for the carrier element, the first and second connection surfaces including a standardized connection surface, and the first connection surface being not identical to the second connection surface.

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