Package structure for surface acoustic wave device, and surface acoustic wave device

Abstract

A method of manufacturing a surface acoustic wave device including a surface acoustic wave element and an electronic component on a package, the method including a component mounting step including mounting the electronic component on the package; an element mounting step including mounting the surface acoustic wave element on the package; an annealing step; a wire bonding step including wire bonding at least one of the electronic component and surface wave element to the package, the wire bonding step being performed after the annealing step.

1. A method of manufacturing a surface acoustic wave device including a surface acoustic wave element and an electronic component on a package, the package including a base defining first and second areas, the method comprising:
 a component mounting step including mounting the electronic component on the package in the first area on the base; 
 an element mounting step including mounting the surface acoustic wave element on the package in the second area on the base; 
 an annealing step; 
 a wire bonding step including wire bonding at least one of the electronic component and surface wave element to the package, 
 the wire bonding step being performed after the annealing step, wherein
 the first and second areas are adjacent relative to a first plane, and 
 a thickness of the base in the first area is less than a thickness of the base in the second area. 
 
 
     
     
       2. The method according to  claim 1 , the component mounting step including mounting the electronic component on the package with a first adhesive and thermally hardening the first adhesive. 
     
     
       3. The method according to  claim 2 , the element mounting step including mounting the surface acoustic wave element on the package with a second adhesive and thermally hardening the second adhesive, the surface acoustic wave element being mounted concurrently with the electronic component. 
     
     
       4. The method according to  claim 3 , the first and second adhesives being thermally hardened concurrently. 
     
     
       5. The method according to  claim 1 , the element mounting step including mounting the surface acoustic wave element on the package with a second adhesive and thermally hardening the second adhesive. 
     
     
       6. The method according to  claim 5 , wherein a mounting area for the surface acoustic wave element includes a center of the surface acoustic wave element in contact with the second adhesive. 
     
     
       7. The method according to  claim 5 , wherein a mounting area for the surface acoustic wave element matches a size of the surface acoustic wave element. 
     
     
       8. The method according to  claim 1 , the wire bonding step including wire bonding both the electronic component and the surface wave element to the package. 
     
     
       9. The method according to  claim 8 , the wire bonding step including concurrently wire bonding the electronic component and surface wave element to the package. 
     
     
       10. The method according to  claim 1 , the wire bonding step including bonding metal wires to metal bonding pads located on at least one of the electronic component and surface wave element, and the annealing step being performed under conditions that would form a eutectic composition between the wires and pads. 
     
     
       11. The method according to  claim 1 , wherein the electronic component and the surface acoustic wave element do not overlap each other in plan view. 
     
     
       12. The method according to  claim 1 , wherein a difference between the thickness of the base in the first area and the thickness of the base in the second area is equal to or greater than a thickness of the electronic component.