Apparatus and method for thermal dissipation in a light

Abstract

A device is disclosed for producing light that may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.

1. A device for producing light, comprising:
 a housing configured to receive a light producing assembly that includes at least one electronics package which generates heat; and 
 a plurality of vents configured in the housing to permit an air flow through the housing to conduct the generated heat out of the housing, 
 wherein the light producing assembly comprises: 
 a plurality of printed circuit boards (PCBs) spaced at an interval and connected by a plurality of pins, the plurality of pins being configured to conduct at least a portion of the generated heat from the at least one electronics package mounted on at least one of the PCBs into the interval so that the air flow passes through the interval and out of the housing, 
 wherein the plurality of PCBs comprise: a first printed circuit board (PCB) that includes a first PCB first surface and the at least one electronics package disposed on the first PCB first surface; a second PCB; and the plurality of pins configured to secure the first PCB to the second PCB at an interval, the plurality of pins forming an array within the interval, 
 wherein at least a portion of the plurality of pins connect to the first PCB proximate the at least one electronics package such that at least a portion of heat generated by the at least one electronics package is receivable by at least a portion of the plurality of pins to conduct the at least a portion of the heat into the interval for dispersion, and 
 wherein the first PCB further comprises; a first PCB second surface; a first core; a first metal layer configured to define a first trace disposed on the first core first surface; and a second metal layer configured to define a second trace disposed on the first core second surface, wherein the first core is interposed between the first metal layer and the second metal layer, and wherein the first trace is in electrical communication with the second trace, and wherein one electronics package is in electrical communication with the first trace. 
 
     
     
       2. The device of  claim 1 , wherein the light producing assembly includes at least one light emitting diode. 
     
     
       3. The device of  claim 2 , wherein the at least one light emitting diode (LED) is formed on one of the PCBs and at least one of the plurality of pins is thermally connected to the at least one LED. 
     
     
       4. The device of  claim 1 , wherein the plurality of vents are formed as openings in the housing with the openings proximate the plurality of pins. 
     
     
       5. The device of  claim 4 , wherein the openings are formed by a plurality of fins. 
     
     
       6. The device of  claim 5 , wherein the plurality of fins have a curvature. 
     
     
       7. The device of  claim 1 , wherein the light producing assembly comprises:
 a first end that produces light; and a second end that connects to an external power source. 
 
     
     
       8. The device of  claim 7 , wherein the plurality of vents are formed by a plurality of fins, each fin configured with a curvature from proximate the first end extending towards the second end. 
     
     
       9. The device of  claim 1 , wherein an overall shape of the device resembles a flood light. 
     
     
       10. The device of  claim 1 , further comprising a threaded electrical connection at one end of the housing for receiving external power. 
     
     
       11. A device for producing light, comprising:
 first means for dissipating heat for a light emitting diode (LED) assembly having two printed circuit boards (PCBs) and for separating the two PCBs at an interval; and 
 a housing to house the first means for dissipating heat, wherein a second means for dissipating heat is formed by the housing, 
 wherein the first means for dissipating is connected thermally proximate an electronics package on one of the PCBs, and 
 wherein the second means for dissipating heat is configured proximate the interval. 
 
     
     
       12. The device of  claim 11 , wherein the housing is configured to orient an electrical connector for powering the electronics package. 
     
     
       13. The device of  claim 12 , wherein the electrical connector is a threaded connector. 
     
     
       14. The device of  claim 11 , wherein the plurality of LEDs are configured to produce visible white light. 
     
     
       15. An apparatus, comprising:
 a housing having a circumference larger at a first end greater than a second end and configured to receive a light assembly having two printed circuit boards (PCBs) held apart at an interval by a plurality of pins In convey heat generated by at least one PCB into the interval; and 
 a plurality of curved fins configured to create a plurality of vents in the housing, the plurality of vents configured to be proximate the interval for permitting air flow into the housing and past the plurality of pins for conveying generated heat out of the housing. 
 
     
     
       16. The apparatus of  claim 15 , wherein each of the plurality of curved fins has a curvature from proximate the first end extending towards the second end. 
     
     
       17. The apparatus of  claim 15 , wherein a circumference at the first end is configured to mate with a circumference of one of the PCBs. 
     
     
       18. The apparatus of  claim 15 , wherein a circumference of the housing proximate the first end is configured to mate with one of the PCBs.