Mount structure, illumination apparatus and liquid crystal apparatus

Abstract

A mount structure includes a wiring board and a semiconductor device composed of a light-emitting device or a light-receiving device mounted on one surface side of the wiring board such that an optical axis thereof is oriented in a direction that extends along a board surface of the wiring board. On the one surface side of the wiring board, a first pad on which a first terminal of the semiconductor device is mounted, a second pad on which a second terminal of the semiconductor device is mounted, and a light-shielding conductive layer are formed using the same conductive layer. The first pad and the second pad are arranged on respective sides of an imaginary center line along which the optical axis of the semiconductor device extends and the light-shielding conductive layer is provided at a position beneath a light emission center or a light reception center of the semiconductor device in plan view.

1. A mount structure comprising:
 a wiring board; 
 a semiconductor device composed of a light-emitting device or a light-receiving device mounted on one surface side of the wiring board such that an optical axis thereof is oriented in a direction that extends along a board surface of the wiring board; and 
 a conductive layer formed only on the one surface side of the wiring board, the conductive layer including
 a first pad on which a first terminal of the semiconductor device is mounted, 
 a second pad on which a second terminal of the semiconductor device is mounted, and 
 a light shielding conductive layer that is formed between portions of the first pad and the second pad in plan view, 
 
 wherein the first pad and the second pad are arranged on respective sides of an imaginary center line along which the optical axis of the semiconductor device extends, and 
 wherein the light shielding conductive layer of the conductive layer is provided at a position beneath a light emission center or a light reception center of the semiconductor device in plan view. 
 
     
     
       2. The mount structure according to  claim 1 , wherein part of the light-shielding conductive layer protrudes from a region beneath the semiconductor device in plan view in a direction in which the optical axis extends. 
     
     
       3. The mount structure according to  claim 1 , wherein the light-shielding conductive layer extends in a direction opposite to that in which the optical axis extends from a position beneath the light emission center or the light reception center of the semiconductor device. 
     
     
       4. The mount structure according to  claim 1 , wherein the light-shielding conductive layer is directly connected to the first pad. 
     
     
       5. The mount structure according to  claim 4 , wherein the light-shielding conductive layer is provided at a leading end side of a connective portion that extends from the first pad and that has smaller width than the first pad. 
     
     
       6. The mount structure according to  claim 1 , wherein a ground potential is applied to the first pad and the light-shielding conductive layer. 
     
     
       7. The mount structure according to  claim 1 , wherein the semiconductor device is a light-emitting device. 
     
     
       8. An illumination apparatus comprising:
 the mount structure according to  claim 7 ; and 
 a light guide plate having a light incidence portion composed of a lateral end surface that faces the light emission center of the light-emitting device and a light emission surface from which light, which was incident from the light incidence portion, is emitted in a direction that intersects the lateral end surface. 
 
     
     
       9. A liquid crystal apparatus comprising: the illumination apparatus according to  claim 8 ; and a liquid crystal panel that modulates and emits light emitted from the illumination apparatus. 
     
     
       10. The mount structure according to  claim 1 , wherein the light-shielding conductive layer is not directly connected to the first pad. 
     
     
       11. A mount structure comprising:
 a wiring board; and 
 a semiconductor device composed of a light-emitting device or a light-receiving device mounted on one surface side of the wiring board such that an optical axis thereof is oriented in a direction that extends along a board surface of the wiring board; 
 wherein a conductive layer is formed on the one surface side of the wiring board, the conductive layer including a first pad on which a first terminal of the semiconductor device is mounted, a second pad on which a second terminal of the semiconductor device is mounted, and a light-shielding conductive layer, 
 wherein the first pad and the second pad are arranged on respective sides of an imaginary center line along which the optical axis of the semiconductor device extends, 
 wherein the light-shielding conductive layer is provided at a position beneath a light emission center or a light reception center of the semiconductor device in plan view, and 
 wherein the light-shielding conductive layer is provided at a leading end side of a connective portion that extends from the first pad and that has smaller width than the first pad.