US8247465B2ActiveUtilityPatentIndex 54
Heat-expandable microspheres, process for producing the same, and application thereof
Est. expiryOct 16, 2027(~1.3 yrs left)· nominal 20-yr term from priority
C08J 2203/22C08J 9/32B01J 13/20Y10T428/2998B01J 13/18B01J 13/14Y10T428/2982
54
PatentIndex Score
2
Cited by
26
References
27
Claims
Abstract
Heat-expandable microspheres include a shell of thermoplastic resin and core material encapsulated in the shell. The core material include a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin and a gas migration inhibitor having a boiling point higher than the softening point of the thermoplastic resin. The ratio of the gas migration inhibitor to the core material is at least 1 weight percent and below 30 weight percent. The average particle size of the heat-expandable microspheres ranges from 1 to 100 micrometers.
Claims
exact text as granted — not AI-modified1. Heat-expandable microspheres, each comprising a shell of thermoplastic resin and core material encapsulated in the shell and having an average particle size ranging from 1 to 100 micrometer;
wherein the core material contains a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin and a gas migration inhibitor having a boiling point higher than the softening point of the thermoplastic resin; and
wherein the weight ratio of the gas migration inhibitor is at least 1 weight percent and lower than 30 weight percent of the core material.
2. Heat-expandable microspheres, each comprising a shell of thermoplastic resin and core material encapsulated in the shell and having an average particle size ranging from 1 to 100 micrometer;
wherein the core material contains a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin and a gas migration inhibitor having a boiling point higher than the softening point of the thermoplastic resin; and
wherein the initial boiling point of the gas migration inhibitor is at least 180 deg.C.
3. The heat-expandable microspheres according to claim 1 , wherein the gas migration inhibitor is at least one member selected from the group consisting of naphthenic oils, paraffinic oils, and aromatic oils.
4. The heat-expandable microspheres according to claim 2 , wherein the gas migration inhibitor is at least one member selected from the group consisting of naphthenic oils, paraffinic oils, and aromatic oils.
5. Heat-expandable micro spheres, each comprising a shell of thermoplastic resin and core material encapsulated in the shell and having an average particle size ranging from 1 to 100 micrometer;
wherein the core material essentially contains a blowing agent having a boiling point not higher than the softening point of the thermoplastic resin; and
wherein B/A is at least 0.7 in the case that the heat-expandable microspheres having an expansion-initiating temperature Ts (deg.C.) and a maximum expansion ratio A (times) are heated for 10 minutes at T (deg.C.) satisfying the relation of (Ts−15)≦T<Ts and thereafter cooled down to room temperature, and the resultant heat-expandable microspheres have a maximum expansion ratio B (times).
6. The heat-expandable microspheres according to claim 5 , wherein the ratio of the true specific gravity of the heat-expandable microspheres after the heating (d) to the true specific gravity of the heat-expandable microspheres before the heating (d 0 ), which is represented by d/d 0 , ranges from 0.5 to 1.3.
7. The heat-expandable microspheres according to claim 1 , wherein the thermoplastic resin is produced by polymerizing a polymerizable component, and the polymerizable component contains, as a monomer component, at least one member selected from the group consisting of nitrile monomers, (meth)acrylate monomers, carboxyl-group-containing monomers, styrene monomers, vinyl acetate, (meth)acrylamide monomers, maleimide monomers, and vinylidene chloride.
8. The heat-expandable microspheres according to claim 2 , wherein the thermoplastic resin is produced by polymerizing a polymerizable component, and the polymerizable component contains, as a monomer component, at least one member selected from the group consisting of nitrile monomers, (meth)acrylate monomers, carboxyl-group-containing monomers, styrene monomers, vinyl acetate, (meth)acrylamide monomers, maleimide monomers, and vinylidene chloride.
9. The heat-expandable microspheres according to claim 5 , wherein the thermoplastic resin is produced by polymerizing a polymerizable component, and the polymerizable component contains, as a monomer component, at least one member selected from the group consisting of nitrile monomers, (meth)acrylate monomers, carboxyl-group-containing monomers, styrene monomers, vinyl acetate, (meth)acrylamide monomers, maleimide monomers, and vinylidene chloride.
10. The heat-expandable microspheres according to claim 1 , having a maximum expansion temperature in the range from 120 deg.C. to 240 deg.C.
11. The heat-expandable microspheres according to claim 2 , having a maximum expansion temperature in the range from 120 deg.C. to 240 deg.C.
12. The heat-expandable microspheres according to claim 5 , having a maximum expansion temperature in the range from 120 deg.C. to 240 deg.C.
13. The heat-expandable microspheres according to claim 1 , further comprising a particulate filler being adhered on the outer surface of the shell of the heat-expandable microspheres.
14. The heat-expandable microspheres according to claim 2 , further comprising a particulate filler being adhered on the outer surface of the shell of the heat-expandable microspheres.
15. The heat-expandable microspheres according to claim 5 , further comprising a particulate filler being adhered on the outer surface of the shell of the heat-expandable microspheres.
16. Hollow microspheres produced by thermally expanding the heat-expandable microspheres according to claim 1 .
17. Hollow microspheres produced by thermally expanding the heat-expandable microspheres according to claim 2 .
18. Hollow microspheres produced by thermally expanding the heat-expandable microspheres according to claim 5 .
19. A composition comprising a base component except diene rubbers, and the heat-expandable microspheres according to claim 1 .
20. A composition comprising a base component except diene rubbers, and the heat-expandable microspheres according to claim 2 .
21. A composition comprising a base component except diene rubbers, and the heat-expandable microspheres according to claim 5 .
22. A composition comprising a base component except diene rubbers, and the hollow microspheres according to claim 16 .
23. A composition comprising a base component except diene rubbers, and the hollow microspheres according to claim 17 .
24. A composition comprising a base component except diene rubbers, and the hollow microspheres according to claim 18 .
25. A formed product produced by giving a shape to the composition according to claim 19 .
26. A formed product produced by giving a shape to the composition according to claim 20 .
27. A formed product produced by giving a shape to the composition according to claim 21 .Cited by (0)
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