Active matrix organic electroluminescent device and method of manufacture thereof

Abstract

An active matrix organic electroluminescent device includes a thin-film transistor, an organic electroluminescent device, and a spacer layer deposited between the thin-film transistor and the organic electroluminescent device, wherein the spacer layer is made of adhesive for a dual curing system selected from the group consisting of ultraviolet curing-thermal curing, ultraviolet curing-microwave curing, ultraviolet curing-anaerobic curing, and ultraviolet curing-electron beam curing system. The present invention solves the poor adhesiveness between the thin-film transistor and the organic electroluminescent device, and improves the moisture and oxygen proof ability. The preparation method is simple, effective, and able to lower the cost and difficulty, and greatly improve the yield rate of the device.

1. An active matrix organic electroluminescent device, comprising:
 a thin-film transistor; 
 an organic electroluminescent device; and 
 a spacer layer deposited between said thin-film transistor and said organic electroluminescent device, wherein said spacer layer is made up of a dual curing system which is achieved by two independent curing stages, one is an ultraviolet curing reaction, the other is a dark reaction, wherein said dual curing system is a curing system selected from the group consisting of: 
 a free radical ultraviolet curing-thermal curing system made of a material comprising:
 30˜40% unsaturated polyester resin or acrylic resin or polymercaptan-polyene; 
 35˜45% epoxy resin or isocyanate or amino resin or free radical thermal curing agent; 
 0.2˜3% styrene and its derivatives or single functional or poly-functional acrylic; 
 0.1˜3% photoinitiator; and 
 0.2˜6% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then heat curing, and lastly ultraviolet curing; or firstly heat curing, then ultraviolet curing, and lastly heat curing; 
 
 a free radical ultraviolet curing-microwave curing system made of a material comprising:
 30˜40% unsaturated polyester resin or acrylic resin or polymercaptan-polyene; 
 35˜45% epoxy resin or isocyanate or amino resin or free radical thermal curing agent; 
 0.2˜3% styrene and its derivatives or single functional or poly-functional acrylic; 
 0.1˜3% photoinitiator; and 
 0.2˜6% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then microwave curing, and lastly ultraviolet curing; or firstly microwave curing, then ultraviolet curing, and lastly heat or microwave curing; 
 
 a free radical ultraviolet curing-anaerobic curing system made of a material comprising:
 55˜65% unsaturated polyester resin or acrylic resin or polymercaptan-polyene; 
 20˜30% dimethacrylate polyol ester or bisphenol-A epoxy polyol ester; 
 0.2˜3% styrene and its derivatives or single functional or poly-functional acrylic; 
 0.1˜3% photoinitiator; and 
 0.2˜6% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then anaerobic curing automatically an adhesive without illumination and under hypoxic condition, and lastly ultraviolet curing; 
 
 to a free radical ultraviolet curing-electron beam curing system made of a material comprising:
 35˜40% unsaturated polyester resin or acrylic resin or polymercaptan-polyene; 
 50˜55% bisphenol-A vinyl ester resin; 
 0.2˜3% styrene and its derivatives or single functional or poly-functional acrylic; 
 0.1˜3% photoinitiator; and 
 0.2˜6% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then electron beam curing in the vacuum, and lastly ultraviolet curing; 
 
 a cationic ultraviolet curing-thermal curing system made of a material comprising:
 35˜45% epoxy resin or modified epoxy resin; 
 40˜45% isocyanate or amino resin or free radical thermal curing agent; 
 4.0˜9% diluting agent; 
 1.2˜3% cationic photoinitiator; and 
 0.2˜3% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then heat curing,and lastly ultraviolet curing; or firstly heat curing, then ultraviolet curing, and lastly heat curing; 
 
 a cationic ultraviolet curing-microwave curing system made of a material comprising:
 35˜45% epoxy resin or modified epoxy resin; 
 40˜45% isocyanate or amino resin or free radical thermal curing agent; 
 4.0˜9% diluting agent; 
 1.2˜3% cationic photoinitiator; and 
 0.2˜3% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then microwave curing,and lastly ultraviolet curing; or firstly microwave curing, then ultraviolet curing, and lastly heat or microwave curing; 
 
 a cationic ultraviolet curing-anaerobic curing system made of a material comprising:
 60˜65% epoxy resin or modified epoxy resin; 
 25˜30% dimethacrylate polyol ester or bisphenol-A epoxy polyol ester; 
 0.4˜9% diluting agent; 
 0.1˜3% cationic photoinitiator; and 
 0.2˜3% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then anaerobic curing automatically an adhesive without illumination and under hypoxic condition, and lastly ultraviolet curing; and 
 
 a cationic ultraviolet curing-electron beam curing system made of a material comprising:
 30˜35% epoxy resin or modified epoxy resin; 
 50˜55% bisphenol-A vinyl ester resin; 
 0.4˜6% diluting agent; 
 0.1˜3% cationic photoinitiator; and 
 0.2˜3% photosensitizer and additive, 
 wherein a curing process is firstly ultraviolet curing, then electron beam curing in the vacuum, and lastly ultraviolet curing. 
 
 
     
     
       2. The active matrix organic electroluminescent device, as recited in  claim 1 , wherein said free radical thermal curing agent comprises: ethylenediamine, hexamethylene diamine, triethylenetetramine, hydroxyethyl diethylene triamine, hydroxyl isopropyl diethylenetriamine, poly ethane diacid adipamide, dimethyl amino propyl amine, tetramethyl propanediamine, dicyandiamide, diaminodiphenylsulfone, diaminodiphenyl methane, m-phenylenediamine, diethyltoluenediamine, N-(aminopropyl)-toluene diamine, dimethylethanolamine, dimethyl benzyl amine, triethyl benzyl amine chloride, benzyl-dimethylamine, N-dimethyl benzyl amine, 2,4,6,-tri-(dimethylaminomethyl)-phenol, phenol-formaldehyde-hexanediamine, N,N-dimethyl benzyl amine, 2-ethylimidazole, 2-phenylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 1-(2-aminoethyl)-2-methylimidazole, maleic anhydride, diphenyl ether tetracid dianhydride, phthalic anhydride, trimellitic anhydride, tetrabromophthalic anhydride, polyazelaic acetic anhydride, sebacic dihydrazide, adipic dihydrazide, carbonic dihydrazide, oxalyl dihydrazide, succinic dihydrazide, adipoyl hydrazide, N-amino polyacrylamide, sebacic hydrazide, isophthalic hydrazide, dihydroxy benzoic acid hydrazide, azelaic acid dihydrazide, isophthalic dihydrazide, ferrocene tetrafluoborate, triallyl cyanurate, toluene diisocyanate, diphenyl-methane-diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, dicyclohexylmethane diisocyanate, xylyl diisocyanate, tetramethyl xylyl diisocyanate, methylstyrene isocyanate, methylcyclohexane diisocyanate, triphenylmethyl-4,4′,4′-triisocyanate, diaminobiphenyl methane, N-chlorophenyl-N—N-dimethylurea, 3-phenyl-1,1-dimethylurea, 3-chlorophenyl-1,1-dimethylurea, 4,4′-diaminodiphenyl bisphenol, polyurethane, urea-formaldehyde resin, epoxy-ethylenediamine carbamate, 2,4,6-tris(dimethylaminomethyl)phenol, 2,4-diaminotoluene, polyurethane, methylated urea formaldehyde resin, tris(3-aminopropyl)amine, 2-aminoethyl-bis(3-aminopropyl)amine, 4,4′-diamino diphenyl methane, 4,4′-diamino diphenyl bisphenol, 4,4′-diamino diphenyl sulfone, tris(3-aminopropyl) amine, melamine resin, benzoguanamine resin, hexamethylol melamine resin, hexamethoxy methyl melamine resin, urea-melamine formaldehyde resin, polyester melamine, trichloro-isocyanurate, amino triazine resin, urethane acrylate, 4-aminopyridine resin, N-β-aminoethyl amino-polyester resin, α-aminopyridine resin, amino diphenyl ether resin, phosphoramidic resin, hydroxyethyl amino polyester resin, said microwave curing adhesive and thermal curing adhesive can be made of the same or different material, said anaerobic curing adhesive comprises tetraethylene glycol dimethacrylate, triethlene glycol bismethylacrylate, triethylene glycol di-methacrylate, glycol dimethacrylate, hydroxyethyl or hydroxypropyl methacrylate, methoxylated poly(ethylene glycol) methyl ether methacrylate, phthalic acid triethylene glycol ester, β-hydroxyethyl methacrylate, triethylene glycol dimethacrylate, dimethacryloyl-ethylthioether, phthalic bis(diethylene glycol acrylate), ethoxylated bisphenol A dimethacrylate, dimethyl acrylic bisphenol A ethylene glycol ester, ethylene methacrylic acid ester, triethylene glycol dimethacrylate, triethlene glycol bismethylacrylate, ethylene glycol bismethylacrylate, diethylene glycol bismethylacrylate, methacrylate epoxy resin, diethylene glycol dimethacrylate, said electron beam curing adhesive comprises tri (4-hydroxyphenyl)methane glycidyl ether epoxy resin, dicyclopentadiene bisphenol epoxy resin, bisphenol A vinyl ester resin, epoxy vinyl ester resin, epoxy acrylic resin, maleimide resin, 4,4′-diphenylmethane bismaleimide, bisphenol A-diphenyl ether bismaleimide, bisphenol A maleicethenyl resin, brominated vinyl ester resin, phenolic epoxy ethenyl resin, hydroxymetyyl bisphenol A epoxy ether, bisphenol A acrylic ester, polyurethane-acrylate, bisphenol A epoxy vinyl ester resin, bisphenol A benzoxazine-epoxy resin,bisphenol fluorine epoxy resin, bisphenol A epoxy acrylic resin, bisphenol A diglycidyl ether, and bisphenol A epoxy chloric acrylic ester resin. 
     
     
       3. The active matrix organic electroluminescent device, as recited in  claim 1 , wherein said photoinitiator comprises benzoin and its derivates benzoin methyl ether, benzoin ethyl ether, acetyl benzene derivates and benzoin isopropyl ether, said cationic photoinitiator comprises aryl sulfonium salt, iodonium salt, and ferrocenium salt, said photo sensitizer comprises benzophenone, thia-anthraquinone and michler's ketone, said additive comprises plasticizer, thixotropic agent and filler. 
     
     
       4. The active matrix organic electroluminescent device, as recited in  claim 3 , wherein said plasticizer comprises phthalic acid bis-1-octyl ester, phthalic acid bis-butyl ester, tris(2-butoxyethyl) phosphate, polyvinyl butyral resin, acetyl tri-n-butyl citrate, dimethyl phthalate, diethyl phthalate, hexanedioic acid bis(butoxyethoxy)ethyl ester, tetraisopropyl titanate, tetrabutyl titanate, citric acid ester, 2-ethylhexyl trimellitate, phthalic acid bis-2-ethylhexyl ester, diisooctyl sebacate, diethylene glycol dibenzoate, phthalic anhydride, dipropylene glycol dibenzoate, and chlorosulfonated polyethylene, said coupling agent comprises vinyl methyldichloro silane, methyldichlorosilane, dimethyldichlorosilane, dimethylchlorosilane, vinyltrichloro silane, 3-aminopropyltrimethoxysilane, polydimethylsiloxane, polymethylhydrosiloxane, polymethylmethoxylsiloxane, 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, γ-glycidicether propyl trimethoxysilane, aminopropyltriethyoxysilane, 3-glycidoxypropyltrimethoxysilane, dodecyl -trimethoxysilane, ethenyltriethyloxysilane, vinyltrimethoxysilane, 3-chloropropyltriethoxysilane, bis-(triethoxysilylpropyl), anilinomethyl-triethoxysliane, N-(β-aminoethyl)-γ-aminopropyltrimethoxy silane, N-(β-Aminoethyl)-γ-aminopropyltriethoxy silane, N-(β-(aminoethyl))-γ-aminopropyl-methyldimethoxy silane, 3-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltrimethylsilane, (3-mercaptopropyl) trimethoxysilane, and 3-mercaptopropyltriethoxysilane.