Method for bonding two electronic components

Abstract

A method for bonding two electronic components includes inserting hollow and open inserts into full convex elements of a lower hardness than that of the inserts, where, when an insert is inserted into a full element at least one surface of the open end of the insert is left free from the full element so as to create an outlet passage for gases contained in the insert.

1. A method for bonding two electronic components by the insertion of hollow and open inserts into full convex elements having a lower hardness than that of the inserts, wherein when an insert is inserted into a full element, at least one surface of the open end of the insert is not in contact with the full element after bonding said two electronic components together, so as to create an outlet passage for gases contained in the insert. 
     
     
       2. The method for bonding two electronic components as claimed in  claim 1 , wherein the open end of the insert is of greater in length, than the length of the full element along at least one predetermined axis. 
     
     
       3. The method for bonding two electronic components as claimed in  claim 2 , wherein the open end of the insert has a plurality of branches partially arranged outside the full element during the insertion. 
     
     
       4. The method for bonding two electronic components as claimed in  claim 2 , wherein the open end of the insert is circular. 
     
     
       5. The method for bonding two electronic components as claimed in  claim 1 , wherein the full elements form a pattern on one surface of one of the two electronic components, in that the inserts form a pattern on one surface of the other of the two electronic components, and in that the insertion is performed by offsetting one pattern relative to the other so as to create an outlet passage for the gases in respect of each insert.