Notch positioning type soldering structure and method for preventing pin deviation

Abstract

A notch positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least one notch, and the solder pads are installed in an alignment direction on the printed circuit board, such that the notch positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

1. A notch positioning type soldering structure, comprising a plurality of solder pads installed on a printed circuit board, for connecting a SMT electronic component having a plurality of circular pins, and the plurality of solder pads having a size greater than a size of the plurality of circular pins, characterized in that each of the plurality of solder pad is disposed in an alignment direction on the printed circuit board, and each of the plurality of pads includes at least one notch, the at least one notch being in a circular arc shape, and the at least one notch is disposed in the alignment direction, a gyration radius of the plurality of circular pins is larger than a radius of the at least one notch, and the at least one notch are disposed in an area corresponding to an external periphery of the plurality of circular pins, each concave side of the at least one notch faces each of the plurality of circular pins for evenly aligning edges of the plurality of circular pins to limit a displacement of the plurality of circular pins. 
     
     
       2. A method for preventing a pin deviation, applied to a printed circuit board soldered with a SMT electronic component having a plurality of pins, and the method comprising the steps of:
 forming a plurality of solder pads installed on a printed circuit board, for connecting a SMT electronic component having a plurality of circular pins, and the plurality of solder pads having a size greater than a size of the plurality of circular pins, characterized in that each of the plurality of solder pad is disposed in an alignment direction on the printed circuit board, and each of the plurality of pads includes at least one notch, the at least one notch being in a circular arc shape, and the at least one notch is disposed in the alignment direction, a gyration radius of the plurality of circular pins is larger than a radius of the at least one notch, and the at least one notch are disposed in an area corresponding to an external periphery of the plurality of circular pins, each concave side of the at least one notch faces each of the plurality of circular pins for evenly aligning edges of the plurality of circular pins to limit a displacement of the plurality of circular pins. 
 
     
     
       3. A notch positioning type soldering structure, comprising a plurality of solder pads installed on a printed circuit board, for connecting a SMT electronic component having a plurality of pins, and the plurality of solder pads having a size greater than a size of the plurality of pins, characterized in that each of the plurality of solder pads is disposed in an alignment direction on the printed circuit board, and each of the plurality of solder pads includes one notch, the notch being in a square, rectangular or circular shape, and the notch is disposed in the alignment direction, and the notch is disposed in an area corresponding to an external periphery of the plurality of pins for evenly aligning edges of the plurality of pins to limit a displacement of the plurality of pins. 
     
     
       4. A method for preventing a pin deviation, applied to a printed circuit board soldered with a SMT electronic component having a plurality of pins, and the method comprising the steps of:
 forming a plurality of solder pads in an alignment direction on the printed circuit board, wherein the plurality of solder pads have a size greater than a size of the plurality of pins, and each of the plurality of solder pads includes one notch, the notch being in at least one of a square, rectangular and circular shape, and the notch is disposed in the alignment direction, and the notch is disposed in an area corresponding to an external periphery of the plurality of pins; and 
 connecting each of the plurality of solder pads to the corresponding pin by a solder, such that the notch of each of the plurality of solder pads are provided for evenly aligning edges of the plurality of pins to limit a displacement of the plurality of pins.