Methods for forming uniform particle layers of phosphor material on a surface

Abstract

A method for forming a layer of an LED phosphor material includes disposing a first surface in a proximity of a powder that includes an LED phosphor material, forming electrostatic charges on the first surface, and forming a layer of the LED phosphor material on the first surface at least partially by using the electrostatic charges. In an embodiment, the method includes disposing the first surface in an interior of a chamber and forming an airborne distribution of the powder in the interior of the chamber in a vicinity of the first surface. In another embodiment, the method includes providing a reservoir of the powder and applying to said phosphor powder an electrostatic charge opposite to that of said electrostatic charge on the first surface.

1. A method for forming a layer of a wavelength converting material, comprising:
 providing an amount of a powder that includes a wavelength converting material; 
 forming an indentation in the powder; 
 forming electrostatic charges on a first surface; disposing the first surface within a volume of the indentation in the powder, proximate to, but spaced apart from, the powder; and 
 forming a layer of the wavelength converting material on the first surface at least partially by using the electrostatic charges. 
 
     
     
       2. The method of  claim 1 , wherein forming a layer of the wavelength converting material on the first surface comprises:
 forming an airborne distribution of the powder in a vicinity of the first surface. 
 
     
     
       3. The method of  claim 1 , wherein disposing the first surface proximate to the powder comprises:
 applying to said powder an electrostatic charge opposite to that of said electrostatic charge on the first surface; and 
 shaping a top portion of the powder to be substantially conformal to the first surface. 
 
     
     
       4. The method of  claim 3 , further comprising shaping the top portion of the powder using a second surface that is substantially conformal to the first surface. 
     
     
       5. The method of  claim 1 , wherein forming a static electric field on the first surface comprises forming a substantially uniform electric field normal to the first surface or a substantially uniform distribution of electrostatic charges on the first surface. 
     
     
       6. The method of  claim 1 , wherein disposing the first surface proximate the powder comprises maintaining a substantially equal distance between the first surface and a top surface of the indentation in the powder. 
     
     
       7. The method of  claim 1 , further comprising controlling the amount of powder on the first surface by varying the electrostatic charges on the first surface. 
     
     
       8. The method of  claim 1 , wherein the first surface comprises a conductive surface, a conductive surface coated with an insulator layer, an insulator surface, or an insulator surface coated with a substantially conductive layer. 
     
     
       9. A method for forming a layer of a wavelength converting material, comprising:
 disposing a first surface in a proximity of a reservoir containing a powder that includes a wavelength converting material, a top surface of the powder having a contour substantially conformal to the contour of the reservoir; 
 forming electrostatic charges on a surface layer of the powder; and 
 forming a layer of the wavelength converting material on the first surface at least partially by using the electrostatic charges. 
 
     
     
       10. The method of  claim 9 , wherein forming electrostatic charges on the surface layer of the powder comprises forming a substantially uniform electric field normal to the surface layer of the powder or a substantially uniform distribution of electrostatic charges on the surface layer of the powder. 
     
     
       11. The method of  claim 9 , wherein disposing the first surface in a proximity of the powder comprises maintaining a substantially equal distance between the first surface and the top surface of the powder in a reservoir. 
     
     
       12. The method of  claim 9 , further comprising:
 applying to said powder an electrostatic charge opposite to that of said electrostatic charge on the first surface; and 
 positioning the first surface in a proximity of the top portion of the powder. 
 
     
     
       13. The method of  claim 9 , further comprising shaping the top portion of the powder using a second surface that is substantially conformal to the first surface. 
     
     
       14. The method of  claim 9 , further comprising:
 forming an airborne distribution of the powder in the interior of the reservoir in a vicinity of the first surface. 
 
     
     
       15. The method of  claim 9 , further comprising controlling the amount of powder on the first surface by varying the electrostatic charges on the first surface. 
     
     
       16. The method of  claim 9 , wherein the first surface comprises a conductive surface, a conductive surface coated with an insulator layer, an insulator surface, or an insulator surface coated with a substantially conductive layer.