Cable assembly with a material at an edge of a substrate

Abstract

The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.

1. A cable assembly comprising a cable including a pair of wires, a housing, a printed circuit board within the housing, the pair of wires attached to the printed circuit board, the printed circuit board includes a substrate and a conductive pad on a surface of the substrate, the substrate has an edge, the conductive pad is located near the edge of the substrate, a material is located on the edge of the substrate, the printed circuit board includes third conductive pads, the wires include a wire shielding and wire insulation, the wires are attached to the third conductive pads, the wires include an unshielded portion with the wire shielding removed from the wire insulation, the unshielded portion is located near the third conductive pads, and second shielding is located at the unshielded portion to provide shielding for the wire pair, the second shielding includes a top shield and an intermediate shield. 
     
     
       2. The cable assembly of  claim 1  wherein the material covers the edge of the substrate. 
     
     
       3. The cable assembly of  claim 1  wherein the material is less abrasive than the edge of the substrate. 
     
     
       4. The cable assembly of  claim 1  wherein the material is a coating. 
     
     
       5. The cable assembly of  claim 4  wherein the edge of the substrate is chamfered. 
     
     
       6. The cable assembly of  claim 4  wherein the conductive pad is free of the material. 
     
     
       7. The cable assembly of  claim 4  wherein the coating is selected from the group consisting of: a conformal coating, a paint, an acrylic, a silicone, a polyurethane, a urethane, an ultra-violet cured coating, a water based coating, a fluoroacrylic, a physical vapor deposition coating, a chemical vapor decomposition coating, and a urethane acrylate. 
     
     
       8. The cable assembly of  claim 1  wherein the material is a plastic. 
     
     
       9. The cable assembly of  claim 1  wherein the substrate has an end, the material provides a transition between the end of the substrate and the conductive pad. 
     
     
       10. The cable assembly of  claim 1  wherein the printed circuit board includes a second conductive pad. 
     
     
       11. The cable assembly of  claim 10  wherein the printed circuit board has a first side and a second side, the conductive pad and the second conductive pad are located on the first side of the printed circuit board. 
     
     
       12. The cable assembly of  claim 10  wherein the printed circuit board has a first side and a second side, the conductive pad is located on the first side of the printed circuit board and the second conductive pad is located on the second side of the printed circuit board. 
     
     
       13. The cable assembly of  claim 1  wherein the printed circuit board includes a trace, the trace extends between the conductive pad and one of the third conductive pads. 
     
     
       14. The cable assembly of  claim 1  wherein the printed circuit board includes a ground layer. 
     
     
       15. The cable assembly of  claim 1  wherein the printed circuit board includes a trace, the printed circuit board includes a ground layer, the ground layer includes a solid portion and a non-solid portion, the conductive pad is located above the non-solid portion of the ground layer, and the trace is located above the solid portion of the ground layer. 
     
     
       16. The cable assembly of  claim 1  wherein the cable assembly includes a latch assembly. 
     
     
       17. The cable assembly of  claim 1  wherein the housing includes an end portion, and the end portion includes angled portions. 
     
     
       18. The cable assembly of  claim 1  wherein the second shielding provides shielding around the unshielded portion of the wire pair. 
     
     
       19. The cable assembly of  claim 18  wherein the second shielding provides 360 degrees of shielding around the unshielded portion of the wire pair. 
     
     
       20. The cable assembly of  claim 1  wherein the cable includes a second pair of wires, the second pair of wires include a wire shielding and wire insulation, the second pair of wires are attached to the third conductive pads, the second pair of wires include a second unshielded portion with the wire shielding removed from the wire insulation, the second unshielded portion is located near the third conductive pads, and second shielding is located at the second unshielded portion to provide shielding for the second pair of wires. 
     
     
       21. The cable assembly of  claim 1  wherein the top shield is attached to the printed circuit board. 
     
     
       22. The cable assembly of  claim 1  wherein the material is molded onto the printed circuit board. 
     
     
       23. The cable assembly of  claim 22  wherein the printed circuit board includes an aperture, the material is located in the aperture. 
     
     
       24. The cable assembly of  claim 1  wherein the printed circuit board includes a removed portion, the material is located in the removed portion. 
     
     
       25. The cable assembly of  claim 1  wherein the edge of the substrate is chamfered. 
     
     
       26. The cable assembly of  claim 1  wherein the conductive pad is free of the material.