Cross-linking compound

Abstract

The presently disclosed embodiments are directed generally to a composition that forms a cross-linked protective outer coating or layer able to withstand high temperatures and which maintains integrity in such conditions. The protective coating may be used in imaging apparatus members and components, for use in electrostatographic, including digital, apparatuses. Particular embodiments pertain to a fuser component having an outer coating comprised of a cross-linking composition that improves resistance to thermal degradation and extends the service life of the fuser component.

1. A composition comprising a resin, an acid catalyst and a compound having the following structure: 
       
         
           
           
               
               
           
         
       
       wherein R i  and R ii  are independently selected from the group consisting of alkyl groups and derivatives thereof. 
     
     
       2. The compound of  claim 1  having a molecular weight (Mw) of from about 300 to about 900 g/mol. 
     
     
       3. The compound of  claim 2  having a molecular weight (Mw) of from about 500 to about 700 g/mol. 
     
     
       4. The composition of  claim 1 , wherein the acid catalyst is selected from the group consisting of p-toluenesulfonic acid, dinonylnaphthalenesulfonic acid, dinonylnaphthalenedisulfonic acid, dodecylbenzenesulfonic acid, and mixtures thereof. 
     
     
       5. The composition of  claim 1 , wherein the resin comprises thermoplastic or thermosetting resins selected from the group consisting of polycarbonates, polyesters, polyurethanes, polystyrenes, polyarylethers, polyarylsulfones, polysulfones, polyethersulfones, polyphenylene sulfides, polyvinyl acetate, polyacrylates, polyvinyl acetals, polyamides, polyimides, amino resins, phenolic resins, phenoxy resins, epoxy resins, phenylene oxide resins, polystyrene and acrylonitrile copolymers, vinyl acetate copolymers, acrylate copolymers, alkyd resins, styrene-butadiene copolymers, styrene-alkyd resins, polyvinylcarbazole, and mixtures thereof. 
     
     
       6. The composition of  claim 5 , wherein the resin is selected from the group consisting of acrylic polyol, polyether polyol, polyester polyol, and mixtures thereof. 
     
     
       7. The composition of  claim 1 , wherein the compound is present in an amount of from about 5 percent to about 95 percent by weight of the total weight of the composition. 
     
     
       8. The composition of  claim 7 , wherein the compound is present in an amount of from about 50 percent to about 75 percent by weight of the total weight of the composition. 
     
     
       9. The composition of  claim 1 , wherein the compound is in gelatinous form. 
     
     
       10. The composition of  claim 1 , wherein the compound is miscible in organic solvents. 
     
     
       11. A composition comprising a resin cross-linked with a compound having the following structure: 
       
         
           
           
               
               
           
         
       
       wherein R i  and R ii  are independently selected alkyl groups or derivatives thereof. 
     
     
       12. The composition of  claim 11 , wherein the resin comprises thermoplastic and thermosetting resins selected from the group consisting of polycarbonates, polyesters, polyurethanes, polystyrenes, polyarylethers, polyarylsulfones, polysulfones, polyethersulfones, polyphenylene sulfides, polyvinyl acetate, polyacrylates, polyvinyl acetals, polyamides, polyimides, amino resins, phenolic resins, phenoxy resins, epoxy resins, phenylene oxide resins, polystyrene and acrylonitrile copolymers, vinyl acetate copolymers, acrylate copolymers, alkyd resins, styrene-butadiene copolymers, styrene-alkyd resins, polyvinylcarbazole, and mixtures thereof. 
     
     
       13. The composition of  claim 12 , wherein the resin is selected from the group consisting of acrylic polyol, polyether polyol, polyester polyol, and mixtures thereof. 
     
     
       14. The composition of  claim 11  having a substantially higher resistance to thermal degradation as compared to a composition without the compound. 
     
     
       15. The composition of  claim 11 , wherein the resin is present in an amount of from about 5 percent to about 95 percent by weight of the total weight of the composition. 
     
     
       16. The composition of  claim 11 , wherein the resin is present in an amount of from about 25 percent to about 50 percent by weight of the total weight of the composition. 
     
     
       17. The composition of  claim 11 , wherein a ratio of the compound to the resin in the composition is from about 0.5 to about 3.