Flexible printed circuit board and method for forming monitor

Abstract

The disclosure relates to a flexible printed circuit board and a method for manufacturing a monitor. The flexible printed circuit board is disposed on a portion of an upper surface of a substrate and is folded to a sidewall and a lower surface of the substrate. The flexible printed circuit board includes a flexible substrate and an insulating layer surrounding the flexible substrate. The insulating layer has an opening at least exposing a portion of the flexible substrate situated relative to the sidewall of the substrate.

1. A flexible printed circuit board, a part of the flexible printed circuit board disposed on a portion of an upper surface of a substrate with another part of the flexible printed circuit board being bent around a sidewall of the substrate and still another part of the flexible printed circuit board being disposed opposite a lower surface of the substrate, wherein the flexible printed circuit board comprises:
 a flexible substrate comprising a first surface and a second surface at opposite sides thereof, the second surface being closer to the sidewall than the first surface; and 
 an insulating layer attached to and surrounding the flexible substrate at least a part of at least one of the first surface and the second surface of the flexible substrate, wherein the insulating layer has an opening exposing a portion of one of said at least one of the first surface and the second surface of the flexible substrate, the opening situated corresponding to the sidewall, and the insulating layer is extended from the top surface to the bottom surface of the substrate via two ends of the opening. 
 
     
     
       2. The flexible printed circuit board according to  claim 1 , wherein the opening is a rectangular opening having two long sides and two short sides. 
     
     
       3. The flexible printed circuit board according to  claim 2 , wherein a distance from the long side to a site of the flexible substrate corresponding to a border between the lower surface and the sidewall of the substrate is smaller than 0.5 mm. 
     
     
       4. The flexible printed circuit board according to  claim 3 , wherein a distance from the short side to an outer lateral edge of the insulating layer is smaller than 0.8 mm. 
     
     
       5. The flexible printed circuit board according to  claim 1 , wherein the insulating layer comprises a polyimide film. 
     
     
       6. The flexible printed circuit board according to  claim 1 , wherein the substrate comprises a liquid crystal display (LCD) panel. 
     
     
       7. The flexible printed circuit board according to  claim 1 , wherein the flexible substrate is a single-layered flexible substrate. 
     
     
       8. The flexible printed circuit board according to  claim 7 , wherein the insulating layer is attached to a part of the first surface of the flexible substrate and surrounds a portion of the first surface of the flexible substrate, and the opening exposes the portion of the first surface of the flexible substrate. 
     
     
       9. The flexible printed circuit board according to  claim 8 , further comprising a plurality of electronic elements disposed on the second surface of the flexible substrate. 
     
     
       10. The flexible printed circuit board according to  claim 8 , wherein the insulating layer is further attached to substantially the entire second surface of the flexible substrate. 
     
     
       11. The flexible printed circuit board according to  claim 8 , wherein the insulating layer is further attached a part of the second surface of the flexible substrate and surrounds a portion of the second surface of the flexible substrate, the insulating layer has another opening exposing a portion of the second surface of the flexible substrate, and the another opening is situated corresponding to the sidewall. 
     
     
       12. The flexible printed circuit board according to  claim 7 , wherein the insulating layer is attached to a part of the second surface of the flexible substrate and surrounds a portion of the second surface of the flexible substrate, and the opening exposes the portion of the second surface of the flexible substrate. 
     
     
       13. A flexible printed circuit board, comprising:
 a first part disposed on a portion of an upper surface of a substrate; 
 a second part adjacent to the first part and bent around a sidewall of the substrate; and 
 a third part adjacent to the second part and disposed opposite a lower surface of the substrate; 
 wherein the flexible printed circuit board further comprises:
 a flexible substrate comprised in all of the first, second and third parts, and comprising a first surface and a second surface at opposite sides thereof, the second surface being closer to the sidewall than the first surface; and 
 an insulating layer attached to at least a part of the first surface of the flexible substrate, wherein the insulating layer has an opening exposing a portion of the first surface of the flexible substrate, the opening situated at the second part and corresponding to the sidewall and the insulating layer is extended from the top surface to the bottom surface of the substrate via two ends of the opening. 
 
 
     
     
       14. The flexible printed circuit board according to  claim 13 , wherein the insulating layer includes a portion located on a periphery of the first surface of the flexible substrate situated at the second part and corresponding to the sidewall. 
     
     
       15. The flexible printed circuit board according to  claim 14 , wherein the opening of the insulating layer is a rectangular opening disposed at a central position of the flexible substrate at the second part and corresponding to a central position of the sidewall. 
     
     
       16. The flexible printed circuit board according to  claim 14 , wherein the insulating layer is further attached to at least a part of the second surface of the flexible substrate. 
     
     
       17. The flexible printed circuit board according to  claim 16 , further comprising a plurality of electronic elements disposed on the part of the second surface of the flexible substrate where the insulating layer is located. 
     
     
       18. The flexible printed circuit board according to  claim 13 , wherein the flexible substrate is a single-layered flexible substrate. 
     
     
       19. The flexible printed circuit board according to  claim 18 , wherein the insulating layer comprises a polyimide film.