Magnet target and magnetron sputtering apparatus having the same

Abstract

A magnet target comprising a fixing plate, a plurality of shafts arranged in an array, a plurality of connecting rods pivotably provided onto a plate surface of the fixing plate at one end and capable of rotating about corresponding one of the shafts, and a plurality of magnets that are each attached to the other fee end of one connecting rod. The magnets comprise magnets having external S poles and magnets having external N poles, and the magnets having external S poles and magnets having external N poles are arranged alternatively in an array.

1. A magnet target comprising:
 a fixing plate, 
 a plurality of shafts arranged in an array; 
 a plurality of connecting rods arranged in an array pivotably provided onto a plate surface of the fixing plate at one end and capable of rotating about corresponding one of the shafts, and 
 a plurality of magnets that are each attached to the other free end of each one of the connecting rods, wherein the magnets comprise magnets each having a central N pole and an external S pole or magnets each having a central S pole and an external N pole, and the magnets each having a central N pole and an external S pole and magnets each having a central S pole and an external N pole are arranged alternatively in a corresponding array. 
 
     
     
       2. The magnet target of  claim 1 , wherein the magnets are circular magnets. 
     
     
       3. The magnet target of  claim 1 , wherein the magnets are soldered to the other free ends of the connecting rods. 
     
     
       4. The magnet target of  claim 1 , wherein the magnets are pin-jointed to the other free ends of the connecting rods. 
     
     
       5. The magnet target of  claim 1 , wherein the magnets are arranged in an array of at least two rows and at least two columns. 
     
     
       6. The magnet target of  claim 1 , wherein the magnets are electromagnets. 
     
     
       7. The magnet target of  claim 6 , wherein current of coils in each electromagnet is individually controlled. 
     
     
       8. The magnet target of  claim 2 , wherein the magnets are electromagnets. 
     
     
       9. The magnet target of  claim 8 , wherein current of coils in each electromagnet is individually controlled. 
     
     
       10. A magnetron sputtering apparatus comprising:
 a sputtering target, 
 a back plate, and 
 a magnet target, wherein the sputtering target is fixed to one side of the back plate and the magnet target is attached to the other side of the back plate, and 
 wherein the magnet target comprises: 
 a fixing plate, 
 a plurality of shafts arranged in an array; 
 a plurality of connecting rods arranged in an array pivotably provided onto a plate surface of the fixing plate at one end and capable of rotating about corresponding one of the shafts, and 
 a plurality of magnets that are each attached to the other free end of each one of the connecting rods, wherein the magnets comprise magnets each having a central N pole and an external S pole or magnets each having a central S pole and an external N pole, and the magnets each having a central N pole and an external S pole and magnets each having a central S pole and an external N pole are arranged alternatively in an array. 
 
     
     
       11. The magnetron sputtering apparatus of  claim 10 , wherein the magnets are circular magnets. 
     
     
       12. The magnetron sputtering apparatus of  claim 10 , wherein the magnets are soldered to the other free ends of the connecting rods. 
     
     
       13. The magnetron sputtering apparatus of  claim 10 , wherein the magnets are pin-jointed to the other free ends of the connecting rods. 
     
     
       14. The magnetron sputtering apparatus of  claim 10 , wherein the magnets are arranged in an array of at least two rows and at least two columns. 
     
     
       15. The magnetron sputtering apparatus of  claim 10 , wherein the magnets are electromagnets. 
     
     
       16. The magnetron sputtering apparatus of  claim 15 , wherein current of coils of each electromagnet is controlled by individual power supplies. 
     
     
       17. The magnetron sputtering apparatus of  claim 11 , wherein the magnets are electromagnets. 
     
     
       18. The magnetron sputtering apparatus of  claim 17 , wherein current of coils of each electromagnet is controlled by individual power supplies. 
     
     
       19. The magnetron sputtering apparatus of  claim 10 , further comprising a drive unit, which controls all the connecting rods to keep in synchronism all along during rotation of the connecting rods.