Suspension substrate, suspension, head suspension, hard disk drive, and method for manufacturing the suspension

Abstract

A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.

1. A suspension substrate including a substrate main body region and a pair of connection structure regions, respectively connectable with actuator elements that are respectively arranged on both sides of the substrate main body region, the suspension substrate comprising:
 an insulating layer; 
 a metallic support layer provided on one face of the insulating layer; 
 a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in the substrate main body region and isolated from each wiring; and 
 an alignment through hole provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer, in the substrate main body region, the alignment through hole being used for alignment for the actuator elements. 
 
     
     
       2. The suspension substrate according to  claim 1 , wherein the alignment through hole is located on a central axis of a load beam for holding the metallic support layer. 
     
     
       3. The suspension substrate according to  claim 1 , further comprising two jig holes, respectively provided to extend through the metallic support layer and insulating layer, the jig holes being used for the alignment when a load beam for holding the metallic support layer is mounted,
 wherein the alignment through hole is located on a straight line connecting the two jig holes. 
 
     
     
       4. The suspension substrate according to  claim 1 ,
 wherein the alignment section of the wiring layer extends to the inward side of the alignment through hole, and 
 wherein a gold plating is provided to an exposed portion of the alignment section of the wiring layer in the alignment through hole. 
 
     
     
       5. The suspension substrate according to  claim 1 , further comprising a protective layer for covering each wiring and the alignment section of the wiring layer,
 wherein the alignment through hole extends through the protective layer. 
 
     
     
       6. A suspension substrate including a substrate main body region and a pair of connection structure regions, respectively connectable with actuator elements that are respectively arranged on both sides of the substrate main body region, the suspension substrate comprising:
 an insulating layer; 
 a metallic support layer provided on one face of the insulating layer; 
 a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in the substrate main body region and isolated from each wiring; 
 a protective layer for covering each wiring and the alignment section of the wiring layer; and 
 an alignment through hole provided in a position corresponding to the alignment section of the wiring layer, the alignment through hole extending through the protective layer and being used for alignment for the actuator elements. 
 
     
     
       7. The suspension substrate according to  claim 6 , wherein the alignment through hole is located on a central axis of a load beam for holding the metallic support layer. 
     
     
       8. The suspension substrate according to  claim 6 , further comprising two jig holes, respectively provided to extend through the metallic support layer and insulating layer, the jig holes being used for the alignment when the load beam for holding the metallic support layer is mounted,
 wherein the alignment through hole is located on a straight line connecting the two jig holes. 
 
     
     
       9. The suspension substrate according to  claim 6 ,
 wherein the alignment through hole extends through the alignment section of the wiring layer and the insulating layer, and 
 wherein a nickel plating is provided to the alignment through hole. 
 
     
     
       10. The suspension substrate according to  claim 6 , wherein a gold plating is provided to an exposed portion of the alignment section of the wiring layer in the alignment through hole. 
     
     
       11. The suspension substrate according to  claim 10 , wherein the protective layer includes a protective layer separation portion formed at a central portion of the alignment through hole. 
     
     
       12. A suspension, comprising:
 a base plate; 
 the suspension substrate according to  claim 1  and attached to the base plate via a load beam; and 
 a pair of actuator elements respectively joined to at least one of the base plate and load beam and connected with the connection structure regions of the suspension substrate. 
 
     
     
       13. The suspension according to  claim 12 , wherein an inspection hole for allowing at least a part of the periphery of the alignment through hole to be exposed is formed in the base plate and load beam. 
     
     
       14. The suspension according to  claim 13 , wherein the inspection hole has a shape different from the alignment through hole. 
     
     
       15. The suspension according to  claim 13 , wherein the periphery of the alignment through hole is all exposed in the inspection hole. 
     
     
       16. A suspension, comprising:
 a base plate; 
 the suspension substrate according to  claim 6  and attached to the base plate via a load beam; and 
 a pair of actuator elements respectively joined to at least one of the base plate and load beam and connected with the connection structure regions of the suspension substrate. 
 
     
     
       17. A head suspension, comprising:
 the suspension according to  claim 12 ; and 
 a slider mounted on the suspension. 
 
     
     
       18. A head suspension, comprising:
 the suspension according to  claim 16 ; and 
 a slider mounted on the suspension. 
 
     
     
       19. A hard disk drive comprising the head suspension according to  claim 17 . 
     
     
       20. A hard disk drive comprising the head suspension according to  claim 18 . 
     
     
       21. A method for manufacturing a suspension including a substrate main body region and a pair of connection structure regions, respectively connectable with actuator elements that are respectively arranged on both sides of the substrate main body region, the method comprising:
 preparing a suspension substrate including an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in the substrate main body region and isolated from each wiring, and an alignment through hole provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer, in the substrate main body region, the alignment through hole being used for alignment for the actuator elements; 
 attaching the suspension substrate to a base plate via a load beam; 
 aligning the actuator elements with the suspension substrate, by using the alignment through hole of the suspension substrate; and 
 joining the aligned actuator elements to at least one of the base plate and load beam by using an adhesive, as well as connecting the actuator elements with the connection structure regions of the suspension substrate.