US8441188B2ActiveUtilityA1

Organic light emitting diode display having substrate spacers of differing heights and method for manufacturing the same

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Assignee: LEE KYUNG-JUNPriority: Jan 7, 2009Filed: Dec 18, 2009Granted: May 14, 2013
Est. expiryJan 7, 2029(~2.5 yrs left)· nominal 20-yr term from priority
Inventors:Kyung Jun Lee
H10K 71/00H10K 59/872H10K 59/8722H10K 59/8723H10K 59/871H10K 50/8428H10K 59/122H10K 50/8426H10K 50/841H10K 2102/351
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PatentIndex Score
6
Cited by
10
References
12
Claims

Abstract

An organic light emitting diode display and a method for manufacturing the same are provided. The organic light emitting diode display includes a display substrate having an organic light emitting diode, an encapsulation substrate arranged opposite to the display substrate, and a sealant is applied between the display substrate and the encapsulation substrate to bond and form a hermetically sealed enclosed space therein. A filler may also be provided in some of the enclosed space. Spacers are formed on at least one of the display substrate and the encapsulation substrate to maintain a predetermined gap between the display substrate and the encapsulation substrate. The heights of the spacers are gradually increased from a central portion of the display substrate toward edges of the display substrate.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. An organic light emitting diode display comprising:
 a display substrate; 
 an encapsulation substrate arranged opposite to the display substrate; 
 at least one organic light emitting diode interposed between the display and encapsulation substrates; 
 a sealant interconnecting the display substrate and the encapsulation substrate while surrounding the at least one diode such that the sealant, the display substrate, and the encapsulation substrate form an enclosed space therein; 
 a plurality of spacers that are formed in a central portion and in a peripheral portion of at least one of the display substrate and the encapsulation substrate and configured to maintain a predetermined gap between the display substrate and the encapsulation substrate within the enclosed space, wherein heights of the plurality of spacers correspond to a distance from the central portion of the display substrate, wherein the heights of the spacers in the central portion are less than the heights of the spacers in the peripheral portion of the display substrate; and 
 a filler configured to fill at least some of the enclosed space, wherein the filler overlaps at least one of the spacers. 
 
     
     
       2. The organic light emitting diode display of  claim 1 , wherein a height of at least one spacer with lowest height is from about ½ to about ⅘ of a height of a spacer with highest height. 
     
     
       3. The organic light emitting diode display of  claim 2 , wherein the at least one spacer with lowest height is located at about the central portion of the display substrate and the spacer with highest height is located at about the edge of the display substrate. 
     
     
       4. The organic light emitting diode display of  claim 1 , wherein the plurality of spacers are formed in a bar shape extending along the display substrate. 
     
     
       5. The organic light emitting diode display of  claim 1 , wherein the plurality of spacers are formed in a cross shape extending along the display substrate. 
     
     
       6. A method of manufacturing an organic light emitting diode display, the method comprising:
 forming a plurality of spacers in a central portion and in a peripheral portion of at least one of a display substrate or an encapsulation substrate, wherein heights of the spacers correspond to a distance from the central portion of the display substrate, wherein the heights of the spacers in the central portion are less than the heights of the spacers in the peripheral portion of the display substrate; 
 applying a sealant on at least one of edges of the display substrate; 
 applying a filler by drops on the display substrate; 
 joining the display substrate with the encapsulation substrate so that the filler is interposed between the display substrate and the encapsulation substrate, and overlaps at least one of the spacers; and 
 bonding the display substrate with the encapsulation substrate via the sealant, wherein hardening of the sealant bonds the display substrate with the encapsulation substrate. 
 
     
     
       7. The method of  claim 6 , wherein the plurality of spacers are configured to control the flow of the filler so that contacting of the filler with the sealant is retarded substantially until the sealant is sufficiently hardened. 
     
     
       8. The method of  claim 7 , wherein the display substrate is adhered to the encapsulation substrate through a vacuum bonding process. 
     
     
       9. The method of  claim 7 , wherein a height of a spacer with lowest height is from about ½ to about ⅘ of a height of a spacer with the highest height. 
     
     
       10. The method of  claim 6 , wherein the plurality of spacers are formed in at least one of a bar or a cross shape along the display substrate. 
     
     
       11. The organic light emitting diode display of  claim 1 , wherein additional spacers are formed between the central portion and the peripheral portion, and the heights of the additional spacers is greater than the height of the spacers in the central portion and is less than the height of the spacers in peripheral portion. 
     
     
       12. The method of  claim 6 , further comprising forming additional spacers between the central portion and the peripheral portion, wherein the heights of the additional spacers is greater than the height of the spacers in the central portion and is less than the height of the spacers in peripheral portion.

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