Suspension board with circuit and production method thereof

Abstract

A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.

What is claimed is: 
     
       1. A suspension board with circuit comprising:
 a metal supporting board; an insulating base layer formed on the metal supporting board; 
 a conductive pattern formed on the insulating base layer; 
 an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and 
 an insertion portion to be inserted into an E-block, the insertion portion being defined along an entire widthwise direction of the suspension board with circuit and having a thickness T 1  of the insulating cover layer over the entire widthwise direction, and extending in a longitudinal direction of the suspension board with circuit, wherein the thickness T 1  of the insulating cover layer in the insertion portion is larger than a thickness T 2  of the insulating cover layer in a portion other than the insertion portion. 
 
     
     
       2. The suspension board with circuit as claimed in  claim 1 , wherein the insertion portion is generally rectangular in shape when viewed in a plan view.