Method of producing wiring substrate

Abstract

A method of producing a wiring substrate includes producing a substrate body including a first primary surface on which a semiconductor chip mounting area is provided and a second primary surface opposed to the first primary surface; attaching a stiffener member on the first primary surface, the stiffener member including an opening which the semiconductor chip mounting area is exposed from; and connecting lead pins to corresponding connection pads provided on the second primary surface by way of electrically conductive members.

What is claimed is: 
     
       1. A method of producing a wiring substrate, comprising:
 producing a substrate body including a first primary surface on which a semiconductor chip mounting area is provided and a second primary surface opposed to the first primary surface; 
 attaching a stiffener member on the first primary surface of the substrate body by an adhesive, the stiffener member including an opening which the semiconductor chip mounting area is exposed from; 
 exposing connection pads and an insulation layer surface at a location at which the opening of the stiffener member is provided at the semiconductor chip mounting area; and 
 connecting lead pins to corresponding connection pads provided on the second primary surface by way of electrically conductive members so that the lead pins are provided on the second primary surface after attaching the stiffener member on the first primary surface. 
 
     
     
       2. The method of producing a wiring substrate according to  claim 1 , further comprising forming an electrically conductive member on connection pads provided in the semiconductor chip mounting area, the forming being carried out between the producing the substrate body and the attaching the stiffener member. 
     
     
       3. The method of producing a wiring substrate according to  claim 2 , wherein a substrate member on which the plural of substrate bodies are provided is produced on a support member and then the support member is removed in the producing the substrate body,
 wherein the substrate member is cut into plural collective entities each of which includes one or more of the substrate bodies between the producing the substrate body and the forming the electrically conductive member, and 
 wherein the electrically conductive member is formed on the connection pads provided in the semiconductor chip mounting area in each of the collective entities in forming the electrically conductive member. 
 
     
     
       4. The method of producing a wiring substrate according to  claim 3 , wherein the plural of stiffener members including respective openings are attached on the corresponding plural substrate bodies included in each of the collective entities in the attaching the stiffener member, and
 wherein the method of producing the wiring substrate further comprises cutting each of the collective entities on which the plural stiffener members are attached, between the adjacent stiffener members, between the attaching the stiffener member and the connecting the lead pins. 
 
     
     
       5. The method of producing a wiring substrate according to  claim 3 , wherein the collective entities including the one or more substrate bodies are cut before the attaching the stiffener member, and
 wherein the stiffener member including the opening is attached on the first primary surface of each of the substrate bodies separated from one another. 
 
     
     
       6. The method of producing a wiring substrate according to  claim 1 , wherein the stiffener member is attached on the first primary surface with a silicone adhesive. 
     
     
       7. The method of producing a wiring substrate according to  claim 6 , further comprising cleaning off silicone that is evaporated from the silicone adhesive and adsorbed on the first primary surface, the cleaning being carried out before the attaching a stiffener member. 
     
     
       8. The method of producing a wiring substrate according to  claim 1 , wherein a thickness of the stiffener member is two times or more greater than a thickness of the substrate body. 
     
     
       9. The method of producing a wiring substrate according to  claim 1 , wherein the stiffener member is made of stainless steel including chromium and nickel as main constituent materials. 
     
     
       10. The method of producing a wiring substrate according to  claim 1 , wherein the stiffener member further comprises another opening which an electric part area is exposed from, and
 wherein the method of producing the wiring substrate further comprises mounting the electric part in a position of the first primary surface, the position corresponding to the another opening. 
 
     
     
       11. The method of producing a wiring substrate according to  claim 1 , wherein the substrate body is a careless multilayer wiring substrate.