US8500248B2ExpiredUtilityA1

Method of manufacturing nozzle plate, liquid ejection head and image forming apparatus

53
Assignee: TAKAHASHI SHUJIPriority: Mar 23, 2006Filed: Sep 21, 2011Granted: Aug 6, 2013
Est. expiryMar 23, 2026(expired)· nominal 20-yr term from priority
Inventors:Shuji Takahashi
B41J 2/1631B41J 2002/14459B41J 2/1645B41J 2/14233B41J 2/1628B41J 2002/14241B41J 2/1646B41J 2/162B41J 2/1642
53
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Cited by
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References
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Claims

Abstract

The method of manufacturing a nozzle plate which includes a nozzle having a tapered section and a linear section includes the steps of: forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; forming a mask layer on a second surface of the silicon substrate reverse to the first surface; performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and removing the mask layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A liquid ejection head, comprising:
 a nozzle plate which includes a nozzle having a tapered section and a linear section and is manufactured by: 
 forming an etching stopper layer for stopping dry etching of a silicon substrate, on a first surface of the silicon substrate; 
 forming a mask layer on a second surface of the silicon substrate reverse to the first surface; 
 performing a first patterning process with respect to the mask layer so that an opening section is formed in the mask layer; 
 carrying out the dry etching of the silicon substrate through the opening section in the mask layer so that the tapered section of the nozzle is formed in the silicon substrate; 
 carrying out dry etching of the etching stopper layer through the opening section in the mask layer so that at least a part of the linear section of the nozzle is formed in the etching stopper layer; and 
 removing the mask layer, 
 wherein an opening diameter of the formed tapered section at the etching stopper layer side is equal to the diameter of the opening section in the mask layer. 
 
     
     
       2. An image forming apparatus comprising the liquid ejection head according  claim 1 .

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