Light emitting diode package and manufacturing method thereof

Abstract

The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

What is claimed is: 
     
       1. A manufacturing method of a light emitting diode (LED) package, the method comprising the steps of:
 forming through holes on a flat-panel type substrate, the substrate made of a light-transmitting material; 
 mounting LED chips at upper parts of the through holes to cover the through holes of the substrate, the LED chips being supported by the substrate; 
 bonding the LED chips and the substrate with wires formed through the through holes; 
 coating a top surface of the substrate with a molding material to cover all sides and top surfaces of the LED chips such that a side surface of the substrate and a side surface of the molding material are substantially coplanar, the molding material being formed of a transparent material; 
 coating a bottom surface of the substrate with an encapsulant to encompass the bonded wires such that the side surface of the substrate, the side surface of the molding material and a side surface of the encapsulant are substantially coplanar, the encapsulant including a resin and a reflective material distributed in the resin; and 
 after curing the molding material and the encapsulant, cutting the LED package into unit LED packages along dicing lines, wherein: 
 the LED package is cut into the unit LED packages such that each of the unit LED packages includes a portion of the substrate, a portion of the molding material and a portion of the encapsulant, 
 a side surface of the portion of the molding material, a side surface of the portion of the substrate and aside surface of the portion of the encapsulant are disposed in this order, in a direction of thickness of the substrate, to be substantially coplanar, and 
 the substantially coplanar surfaces of each unit LED package form outer surfaces of the unit LED package, and 
 wherein the molding material is made of resin mixed with a fluorescent material, is molded around the LED chip mounted on the substrate to be directly in contact with a top surface of the LED and lateral surfaces of the LED chip and is coated at a predetermined thickness thereon; and 
 wherein the molding material has a wave-length conversion feature, the encapsulant has a reflectivity feature, and the substrate has a transparency feature, and 
 wherein the molding material and the encapsulant do not directly contact each other and are separated by the substrate having the optical feature of transparency. 
 
     
     
       2. The method of  claim 1 , wherein the through holes are formed in sizes to be covered by the LED chips in the step of forming the through holes on the substrate. 
     
     
       3. The method of  claim 1 , wherein the molding material and the encapsulant are coated at predetermined thicknesses by any one of coating methods such as squeeze, screen printing, silk screen, and stencil. 
     
     
       4. The method of  claim 3 , wherein the molding material and the encapsulant are coated at upper and lower parts of the substrate by a dispensing method. 
     
     
       5. The method of  claim 4 , wherein when the molding material and the encapsulant are coated by the dispensing method, the molding material and the encapsulant are formed after individually manufacturing the substrate mounting the LED chip. 
     
     
       6. The method of  claim 1 , wherein the molding material is made of resin mixed with the fluorescent material and silicon and the fluorescent material is any one of a blue, red or green fluorescent material. 
     
     
       7. A manufacturing method of a light emitting diode (LED) package, the method comprising the steps of:
 forming through holes on a flat-panel type substrate; 
 mounting LED chips at upper parts of the through holes to cover the through holes of the substrate, the LED chips being supported by the substrate, the substrate made of a light-transmitting material; 
 bonding the LED chips and the substrate with wires formed through the through holes; 
 after bonding the LED chips and the substrate with the wires, coating a top surface of the substrate with a molding material to cover all sides and top surfaces of the LED chips, the molding material being formed of a transparent material; 
 coating a bottom surface of the substrate in a lump with an encapsulant to encompass the bonded wires and to cover the entirety of the bottom surface of the substrate, the encapsulant including a resin and a reflective material distributed in the resin; 
 after curing the molding material and the encapsulant, cutting the LED package into unit LED packages along dicing lines, and 
 wherein the molding material is made of resin mixed with a fluorescent material, is molded around the LED chip mounted on the substrate to be directly in contact with a top surface of the LED chip and lateral surfaces of the LED chip and is coated at a predetermined thickness thereon; and 
 wherein the molding material has a wave-length conversion feature, the encapsulant has a reflectivity feature, and the substrate has a transparency feature, and 
 wherein the molding material and the encapsulant do not directly contact each other and are separated by the substrate having the optical feature of transparency. 
 
     
     
       8. The method of  claim 7 , wherein
 the LED package is cut into unit LED packages along dicing lines by cutting all of the substrate, the molding material and the encapsulant along each of the dice lines.