Opto-electric hybrid board and manufacturing method therefor

Abstract

Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.

What is claimed is: 
     
       1. An opto-electric hybrid board, comprising:
 an optical waveguide unit; and 
 an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit, 
 wherein the optical waveguide unit comprises:
 an undercladding layer; and 
 a core for an optical path and a socket portion for locating the electric circuit unit, the core and the socket portion being formed on a surface of the undercladding layer, the socket portion being formed of the same material as a forming material for the core; 
 
 wherein the electric circuit unit comprises:
 an electric circuit board; 
 the optical element mounted at a predetermined portion on the electric circuit board; and 
 a bent portion formed by bending a part of the electric circuit board so as to stand upright, for fitting into the socket portion; 
 
 wherein the socket portion of the optical waveguide unit is located at a predetermined location with reference to a location at which the core is formed with respect to one end surface of the core; 
 wherein the socket portion is capable of nipping; 
 wherein the bent portion of the electric circuit unit is located and formed at a predetermined location with respect to the optical element; and 
 wherein the optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the bent portion of the electric circuit unit fits into the socket portion of the optical waveguide unit. 
 
     
     
       2. The opto-electric hybrid board according to  claim 1 ,
 wherein the socket portion of the optical waveguide unit is a projecting portion which is substantially V-shaped in plan view, and 
 wherein the bent portion of the electric circuit unit fits into the projecting portion in a state of being sandwiched between substantially V-shaped opposing inner wall surfaces of the projecting portion. 
 
     
     
       3. A manufacturing method for an opto-electric hybrid board in which an optical waveguide unit and an electric circuit unit having an optical element mounted thereon are coupled, the method comprising:
 manufacturing the optical waveguide unit comprising:
 forming an undercladding layer; and 
 forming, on a surface of the undercladding layer, a core for an optical path and a socket portion for locating the electric circuit unit, the forming of the core and the socket portion comprising forming, by photolithography, the socket portion for locating the electric circuit unit simultaneously with the forming of the core, the socket portion being formed of the same material as a forming material for the core, at a predetermined location located with respect to one end surface of the core; 
 
 manufacturing the electric circuit unit comprising:
 forming an electric circuit board; 
 mounting the optical element at a predetermined portion on the electric circuit board; and 
 forming, after the mounting the optical element, a bent portion for fitting into the socket portion by bending so as to stand upright at a predetermined location with respect to the optical element; and 
 
 coupling the optical waveguide unit and the electric circuit unit, the coupling comprising fitting the bent portion of the electric circuit unit into the socket portion of the optical waveguide unit. 
 
     
     
       4. The manufacturing method for an opto-electric hybrid board according to  claim 3 ,
 wherein the forming of the socket portion comprises forming the socket portion to be a projecting portion which is substantially V-shaped in plan view, and 
 wherein the fitting the bent portion comprises causing the bent portion of the electric circuit unit to be sandwiched between substantially V-shaped opposing inner wall surfaces of the projecting portion.