P
US8664765B2ActiveUtilityPatentIndex 40

Semiconductor device

Assignee: ONISHI KAZUNAGAPriority: Dec 3, 2010Filed: Sep 8, 2011Granted: Mar 4, 2014
Est. expiryDec 3, 2030(~4.4 yrs left)· nominal 20-yr term from priority
Inventors:ONISHI KAZUNAGATAKAMIYA YOSHIKAZUFUNAKOSHI TAKAAKIKODAIRA YOSHIHIRO
H10W 90/754H10W 90/753H10W 90/734H10W 72/07311H10W 72/5525H10W 72/5524H10W 72/5522H10W 72/5475H10W 72/5473H10W 72/5445H10W 72/952H10W 72/884H10W 72/387H10W 72/352H10W 72/075H10W 72/073H10W 72/59H10W 90/00H10W 70/65H10W 40/255H10W 90/701
40
PatentIndex Score
0
Cited by
6
References
11
Claims

Abstract

A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A semiconductor device, characterized by comprising:
 a substrate; 
 an insulating substrate mounted on the substrate; 
 a metal layer formed on the insulating substrate; 
 an electronic part mounted on the metal layer across a bond; and 
 a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal layer and around the electronic part. 
 
     
     
       2. The semiconductor device according to  claim 1 , characterized in that
 the wire member is disposed between the electronic part and an edge of the metal layer. 
 
     
     
       3. The semiconductor device according to  claim 2 , characterized in that
 the wire member has a wire portion, and the wire portion extends along the edge of the metal layer. 
 
     
     
       4. The semiconductor device according to  claim 2 , characterized in that
 the wire member has a bonding portion, and a plurality of the bonding portions are disposed aligned along the edge of the metal layer. 
 
     
     
       5. The semiconductor device according to  claim 2 , characterized in that
 the electronic part is an external connection terminal. 
 
     
     
       6. The semiconductor device according to  claim 1 , characterized in that
 another electronic part is mounted on the metal layer across a bond, and 
 the wire member is disposed between the electronic part and the other electronic part. 
 
     
     
       7. The semiconductor device according to  claim 6 , characterized in that
 the wire member has a wire portion, and the wire portion extends in a direction crossing the direction joining the electronic part and other electronic part. 
 
     
     
       8. The semiconductor device according to  claim 6 , characterized in that
 the wire member has a bonding portion, and a plurality of the bonding portions are disposed aligned in a direction crossing the direction joining the electronic part and other electronic part. 
 
     
     
       9. The semiconductor device according to  claim 6 , characterized in that
 the electronic part is an external connection terminal, and the other electronic part is a semiconductor element. 
 
     
     
       10. The semiconductor device according to  claim 6 , characterized in that
 each of the electronic part and the other electronic part is a semiconductor element. 
 
     
     
       11. The semiconductor device according to  claim 1 , characterized in that
 the bond is solder.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.