Ultra-small chip package and method for manufacturing the same

Abstract

Some embodiments of the present disclosure provide the design and manufacture of an ultra-small chip assembly. The ultra-small chip assembly comprises a die, a plate-like back electrode disposed on the back-side of the die, and one or more plate-like positive electrodes disposed on the front-side of the die. The ultra-small chip assembly is configured such that one end of the plate-like back electrode extends beyond a first side of the die, and each of the one or more plate-like positive electrodes includes an end which extends beyond a second side of the die. By attaching both the plate-like back electrode and the plate-like positive electrodes on the surfaces of the die, and directly using the exposed ends of the plate-like electrodes as the lead-out electrodes for the chip assembly, the electrical connections outside of the die only occupy a very small volume.

What is claimed is: 
     
       1. A semiconductor device, comprising
 a semiconductor die with a front side, a back side, and edges; 
 a conductive mounting platform attached to the back side of the die and extending over an edge of the die; 
 a clip attached to the front side of the die and extending over the edge of the die; 
 a plastic body with edges encapsulating the semiconductor die and a portion of the conductive mounting platform and a portion of the clip, 
 a portion of the extended mounting platform and a portion of the extended clip exposed from an edge of the plastic body, and 
 in which the clip including a portion that is attached to the die and is coplanar to the portion of the clip that extends over the edge of die. 
 
     
     
       2. The semiconductor device of  claim 1 , in which a portion of exposed mounting platform and a portion of exposed clip are coplanar. 
     
     
       3. The semiconductor device of  claim 2 , in which the coplanar portion of the exposed mounting platform and the coplanar portion of the exposed clip are coplanar with the edge of the plastic body. 
     
     
       4. The semiconductor device of  claim 1 , in which the clip includes multiple electrodes. 
     
     
       5. The semiconductor device of  claim 4 , in which each of the electrodes extends over the edge of the die and partially exposed from the plastic body. 
     
     
       6. The semiconductor device of  claim 4 , in which each of the electrodes includes a portion that is attached to the die and is coplanar to the portion of the electrode that extends over the edge of die. 
     
     
       7. The semiconductor device of  claim 5 , in which an exposed portion of the mounting platform is coplanar to an exposed portion of each electrode. 
     
     
       8. The semiconductor device of  claim 2 , in which the coplanar portion of the exposed portion of the mounting platform and the coplanar portion of the exposed portion of the electrode are coplanar with the edge of the plastic body. 
     
     
       9. A semiconductor device, comprising:
 a semiconductor die with a front side, a back side, and edges; 
 a plate-like flat clip of multiple electrodes attached to the front side of the die and extending over the edge of the die; and 
 a plastic body with edges encapsulating the semiconductor die and portions of the clip and exposing end portions of the clip at an edge of the plastic body. 
 
     
     
       10. The semiconductor device of  claim 9 , in which the exposed end portions of the clip are coplanar.