Bond line control process

Abstract

A method and apparatus for bonding parts. An adhesive and a plurality of beads may be applied onto a first surface of a first part to form a layer of adhesive and beads. The first surface of the first part with the layer of adhesive and beads may be placed in contact with a second surface of a second part to form a structure, wherein the structure may be cured.

What is claimed is: 
     
       1. A method for bonding parts, the method comprising:
 applying an adhesive and a plurality of beads onto an area of a first surface of a first part through a screen to form a layer of adhesive and beads having a substantially uniform thickness over said area of said first surface, the plurality of beads each have a size that is about equal to said substantially uniform thickness; 
 following applying said adhesive layer with said substantially uniform thickness, placing the first surface of the first part with the layer of adhesive and beads in contact with a second surface of a second part to form a structure, said adhesive layer covering an entire area between said first surface and said second surface, the screen having the substantially uniform thickness, the adhesive and the plurality of beads being applied onto the first surface of the first part through the screen to form the layer of adhesive and beads, and the layer of adhesive and beads having substantially the thickness of the screen; and 
 curing the structure. 
 
     
     
       2. The method of  claim 1 , wherein the beads maintain uniform thickness for the adhesive when joining the first surface of the first part with the second surface of the second part. 
     
     
       3. The method of  claim 2  further comprising:
 removing the screen before placing the first surface of the first part with the layer of adhesive and beads in contact with a second surface of the second part to form the structure. 
 
     
     
       4. The method of  claim 1 , wherein the plurality of beads maintains said substantially uniform thickness for the layer of adhesive and beads when applied to the first surface of the first part. 
     
     
       5. The method of  claim 1 , further comprising bagging the structure prior to curing. 
     
     
       6. The method of  claim 1 , wherein applying comprises:
 placing a mask onto the first surface of the first part; 
 placing the screen onto the mask to form an exposed area on the first surface of the first part; and 
 applying the adhesive and the plurality of beads onto the exposed area on the first surface of the first part through the screen. 
 
     
     
       7. The method of  claim 1 , wherein the adhesive is an adhesive paste. 
     
     
       8. The method of  claim 1 , wherein the plurality of beads is a plurality of spheres. 
     
     
       9. The method of  claim 1 , wherein the plurality of beads is comprised of a material selected from one of glass, ceramic, metal, and rubber. 
     
     
       10. The method of  claim 1 , wherein the first part is comprised of a material selected from one of a composite material, a metal, aluminum, and titanium. 
     
     
       11. The method of  claim 1 , wherein the first part is a skin panel, and the second part is a patch.