Microstructure, micromachine, and manufacturing method of microstructure and micromachine

Abstract

Without sacrificial layer etching, a microstructure and a micromachine are manufactured. A separation layer 102 is formed over a substrate 101 , and a layer 103 to be a movable electrode is formed over the separation layer 102 . At an interface of the separation layer 102 , the layer 103 to be a movable electrode is separated from the substrate. A layer 106 to be a fixed electrode is formed over another substrate 105 . The layer 103 to be a movable electrode is fixed to the substrate 105 with the spacer layer 103 which is partially provided interposed therebetween, so that the layer 103 to be a movable electrode and a layer 106 to be a fixed electrode face each other.

What is claimed is: 
     
       1. A manufacturing method of a microstructure, comprising the steps of:
 forming a separation layer over a first support substrate; 
 forming a first layer over the separation layer; 
 exposing a part of the separation layer; 
 attaching a second support substrate to the first layer with an adhesive layer interposed therebetween; 
 
       separating the first support substrate from the first layer so that the first remains on the second support substrate;
 forming a spacer layer over a first protective substrate; 
 attaching the first layer and the first protective substrate so as to face each other with the spacer layer interposed therebetween; and 
 separating the first layer from the second support substrate further wherein said first support substrate is a light transmitting substrate. 
 
     
     
       2. A manufacturing method of a microstructure, comprising the steps of:
 forming a separation layer over a first support substrate; 
 forming a first layer over the separation layer; 
 exposing a part of the separation layer; 
 attaching a second support substrate to the first layer with an adhesive layer interposed therebetween; 
 separating the first support substrate from the first layer so that the first remains on the second support substrate; 
 forming a first spacer layer over a first protective substrate; 
 forming a second spacer layer over a second protective substrate; 
 attaching the first layer and the first protective substrate so as to face each other with the first spacer layer interposed therebetween; 
 separating the first layer from the second support substrate; and 
 attaching the first layer and the second protective substrate so as to face each other with the second spacer layer interposed therebetween further wherein said first support substrate is a light transmitting substrate. 
 
     
     
       3. The manufacturing method of a microstructure according to  claim 2 , wherein a third layer is formed for the second protective substrate. 
     
     
       4. The manufacturing method of a microstructure according to  claim 1 , wherein a second layer is formed for the first protective substrate. 
     
     
       5. The manufacturing method of a microstructure according to  claim 2 , wherein a second layer is formed for the first protective substrate. 
     
     
       6. The manufacturing method of a microstructure according to  claim 3 , wherein a second layer is formed for the first protective substrate. 
     
     
       7. A manufacturing method of a micromachine, comprising the steps of:
 forming a separation layer over a first support substrate; 
 forming a first layer over the separation layer; 
 exposing a part of the separation layer; 
 attaching a second support substrate to the first layer with an adhesive layer interposed therebetween; 
 separating the first support substrate from the first layer so that the first remains on the second support substrate; 
 forming a layer including a semiconductor element over a first protective substrate; 
 forming a spacer layer over the layer including the semiconductor element; 
 attaching the first layer and the first protective substrate so as to face each other with the spacer layer interposed therebetween; and 
 separating the first layer from the second support substrate wherein said first support substrate is a flexible substrate. 
 
     
     
       8. A manufacturing method of a microstructure, comprising the steps of:
 forming a separation layer over a first support substrate; 
 forming a first layer over the separation layer; 
 exposing a part of the separation layer; 
 attaching a second support substrate to the first layer with an adhesive layer interposed therebetween; 
 separating the first layer from the first support substrate from the first layer so that the first remains on the second support substrate; 
 forming a first spacer layer over a layer including a semiconductor element; 
 forming a second spacer layer over a second protective substrate; 
 attaching the first layer and the first protective substrate so as to face each other with the first spacer layer interposed therebetween; 
 separating the first layer from the second support substrate; and 
 attaching the first layer and the second protective substrate so as to face each other with the second spacer layer interposed therebetween wherein said first support substrate is a flexible substrate.