Copper bonding compatible bond pad structure and method

Abstract

A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.

We claim: 
     
       1. A method of forming a Cu bonding compatible bond pad structure comprising the steps of:
 depositing passivation material upon said bond pad structure; 
 patterning a buffering structure pattern on said passivation material to provide a plurality of spaced-apart regions of said passivation material spaced-apart along a first direction, defining a plurality of hiatuses, portions of said bond pad structure in superimposition with said hiatuses being exposed and spaced-apart from a crown surface of said regions along a second direction, extending transversely to said first direction; 
 etching said buffering structure pattern to create said Cu bonding compatible bond pad structure; and 
 attaching a bond wire to a top of said buffer structure pattern pushing a portion of the buffer structure pattern downward for the bond wire connecting to a metal layer underneath the buffer structure pattern.