US8772781B2ActiveUtilityPatentIndex 67
Wiring structure, thin film transistor array substrate including the same, and display device
Est. expiryNov 7, 2031(~5.3 yrs left)· nominal 20-yr term from priority
H10D 30/6743H10D 30/6737H10D 30/6729H10D 86/441H10D 86/60G02F 1/1345G02F 1/136286G02F 1/136295G02F 1/136231G02F 1/134372
67
PatentIndex Score
5
Cited by
6
References
7
Claims
Abstract
On each of wiring conversion parts connected to a first conductive film and a second conductive film each functioning as a wiring, a first transparent conductive film does not cover an end surface of the second conductive film in proximity to a corner of the first transparent conductive film, and has a portion covering the end surface of the second conductive film on a portion other than the proximity of the corners. A second transparent conductive film as an upper layer of the first transparent conductive film is connected to the first conductive film and the second conductive film, so that the first conductive film and the second conductive film are electrically connected.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A wiring structure comprising:
an upper layer conductive film; and
a first transparent conductive film formed on said upper layer conductive film to be in contact with said upper layer conductive film, wherein
said first transparent conductive film does not cover an end surface of said upper layer conductive film in proximity to a corner of the first transparent conductive film, and has a portion that covers the end surface of said upper layer conductive film to contact the end surface of said upper layer conductive film on a portion other than said proximity of the corner.
2. The wiring structure according to claim 1 , wherein said upper layer conductive film is a laminated film formed by stacking different types of conductive films.
3. The wiring structure according to claim 1 , further comprising: a semiconductor film electrically connected to the upper layer conductive below said upper layer conductive film.
4. The wiring structure according to claim 1 , wherein no semiconductor film is formed below said upper layer conductive film.
5. The wiring structure according to claim 1 , further comprising:
an insulating film formed on said first transparent conductive film;
a lower layer conductive film as a layer different from said upper layer conductive film, formed below said insulating film;
a first contact hole formed in said insulating film, and reaching said first transparent conductive film;
a second contact hole formed in said insulating film, and reaching said lower layer conductive film; and
a second transparent conductive film formed on said insulating film, connected to said first transparent conductive film through said first contact hole, and connected to said lower layer conductive film through said second contact hole.
6. A thin film transistor array substrate comprising:
the wiring structure according to claim 1 .
7. A display device comprising:
a display panel formed by using the thin film transistor array substrate according to claim 6 .Cited by (0)
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References (0)
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