Fluorene-based resin polymer and photo-sensitive resin composition comprising the same

Abstract

The present invention relates to a fluorene-based resin polymer, and a photosensitive resin composition including the same, and the fluorene-based resin polymer according to the exemplary embodiment of the present invention has a high molecular weight, a low acid value, and excellent developing property, adhesive property and stability.

What is claimed is: 
     
       1. A fluorene-based resin polymer, comprising:
 a repeating unit represented by the following Formula 1: 
 
       
         
           
           
               
               
           
         
         wherein, 
         X 1 , X 2 , X 3 , X 4 , Z 1 , Z 2 , Z 3  and Z 4  are the same as or different from each other, and each independently selected from the group consisting of an alkylene group having 1 to 3 carbon atoms, an ethylene oxide group and a propylene oxide group, 
         Y 1  and Y 2  are the same as or different from each other, and each independently selected from the group consisting of an alkylene group having 1 to 5 carbon atoms, a cycloalkylene group having 3 to 10 carbon atoms, a cycloalkenylene group having 3 to 10 carbon atoms and an arylene group having 6 to 10 carbon atoms, 
         R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7  and R 8  are the same as or different from each other, and each independently hydrogen, or an alkyl group having 1 to 3 carbon atoms, and 
         n is an integer of 1 to 5,000. 
       
     
     
       2. The fluorene-based resin polymer according to  claim 1 , wherein the Formula 1 is represented by the following Formula 2: 
       
         
           
           
               
               
           
         
         wherein n is an integer of 1 to 5,000. 
       
     
     
       3. The fluorene-based resin polymer according to  claim 1 , wherein a weight average molecular weight of the fluorene-based resin polymer is 1,000 to 50,000. 
     
     
       4. The fluorene-based resin polymer according to  claim 1 , wherein an acid value of the fluorene-based resin polymer is 30 to 150 KOH mg/g. 
     
     
       5. A photosensitive resin composition, comprising:
 the fluorene-based resin polymer according to  claim 1 , 
 a polymerizable compound including an ethylene unsaturated bond, 
 a photoinitiator, and 
 a solvent. 
 
     
     
       6. The photosensitive resin composition according to  claim 5 , wherein a content of the fluorene-based resin polymer is 1 to 20 wt % on the basis of a total weight of the photosensitive resin composition. 
     
     
       7. The photosensitive resin composition according to  claim 5 , wherein the polymerizable compound including the ethylene unsaturated bond includes one or more selected from the group consisting of pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethylene glycol di(meth)acrylate and polyethylene glycol di(meth)acrylate. 
     
     
       8. The photosensitive resin composition according to  claim 5 , wherein a content of the polymerizable compound including the ethylene unsaturated bond is 1 to 30 wt % on the basis of a total weight of the photosensitive resin composition. 
     
     
       9. The photosensitive resin composition according to  claim 5 , wherein the photoinitiator includes one or more selected from the group consisting of a triazine-based compound, an acetophenone-based compound and a benzophenone-based compound. 
     
     
       10. The photosensitive resin composition according to  claim 5 , wherein a content of the photoinitiator is 0.1 to 5 wt % on the basis of a total weight of the photosensitive resin composition. 
     
     
       11. The photosensitive resin composition according to  claim 5 , wherein the solvent includes one or more selected from the group consisting of methyl ethyl ketone, propylene glycol diethyl ether, propylene glycol methyl ether acetate, 3-methoxybutyl acetate and dipropylene glycol monomethyl ether. 
     
     
       12. The photosensitive resin composition according to  claim 5 , wherein a content of the solvent is 45 to 95 wt % on the basis of a total weight of the photosensitive resin composition. 
     
     
       13. The photosensitive resin composition according to  claim 5 , wherein the photosensitive resin composition further includes one or more selected from the group consisting of a colorant, a curing accelerator, a thermal polymerization inhibitor, a surfactant, a photosensitizer, a plasticizer, an adhesion promotor, a filler and an adhesive. 
     
     
       14. A photosensitive material manufactured by using the photosensitive resin composition of  claim 5 . 
     
     
       15. The photosensitive material according to  claim 14 , wherein the photosensitive material is selected from the group consisting of a pigment dispersion type photosensitive material for manufacturing a color filter, a photosensitive material for forming a black matrix, a photosensitive material for forming an overcoat layer, a column spacer photosensitive material, and a photosensitive material for a printed circuit board.