Image sensor device with opaque coating

Abstract

The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.

What is claimed is: 
     
       1. An image sensor device, comprising:
 a chip package comprising an image sensor array chip; 
 a set of optical elements connecting to the image sensor array chip and configured with an aperture module; 
 an outer frame overlying the image sensor array chip, shielding and connecting the set of optical elements; 
 an opaque coating overlying the outer frame and the aperture module to prevent unwanted light incidence into the image sensor device and shield parts of regions over the set of optical elements, and comprising an opening precisely aligned with an aperture opening of the aperture module; 
 a first transparent substrate between the image sensor array chip and the set of optical elements, wherein the image sensor array chip is attached on the first transparent substrate; 
 a second transparent substrate between the first transparent substrate and the set of optical elements, wherein the second transparent substrate is spaced from the set of optical elements, and wherein the second transparent substrate occupies parts of an upper surface of the first transparent substrate; and 
 a protection layer, 
 wherein a first surface of the protection layer is attached to the image sensor array chip, and 
 wherein the image sensor array chip is arranged between the first transparent substrate and at least a portion of the protective layer. 
 
     
     
       2. The device as claimed in  claim 1 , wherein the set of optical elements comprises a set of lenses configured with an aperture module and directly connected to the outer frame. 
     
     
       3. The device as claimed in  claim 2 , wherein the opaque coating leaves the set of lenses exposed by the aperture opening. 
     
     
       4. The device as claimed in  claim 1 , wherein
 the footprint of the first transparent substrate is larger than that of the set of optical elements; and 
 the outer frame and the overlying opaque coating extend to overlie the unoccupied parts of the upper surface of the first transparent substrate. 
 
     
     
       5. The method as claimed in  claim 4 , wherein the outer frame further extends to a side surface of the first transparent substrate. 
     
     
       6. The device as claimed in  claim 1 , wherein the footprint of the first transparent substrate is smaller than that of the set of optical elements; and
 the outer frame and the opaque coating extend to be between the first and second transparent substrates and leave an image sensor array of the image sensor array chip exposed. 
 
     
     
       7. The device as claimed in  claim 1 , further comprising an opaque layer, the opaque layer attached to a second surface, opposite to the first surface, of the protection layer. 
     
     
       8. The device as claimed in  claim 1 , wherein the opaque coating conformally overlies the outer frame and the aperture module due to spraying, spin coating, dipping, tapping, or sputtering. 
     
     
       9. The device as claimed in  claim 1 , wherein the opaque coating is an acrylic resin or epoxy resin overlying the outer frame and the aperture module. 
     
     
       10. The device as claimed in  claim 1 , wherein the opaque coating extends to an edge of the aperture opening of the aperture module, thus forming the opening of the opaque coating that is precisely aligned with the aperture opening of the aperture module. 
     
     
       11. An image sensor device, comprising:
 a chip package comprising an image sensor array chip; 
 a set of optical elements connecting to the image sensor array chip and configured with an aperture module; 
 an outer frame overlying the set of optical elements, shielding and connecting the set of optical elements; 
 a supporter connecting the set of optical elements and the outer frame; 
 an opaque coating overlying the outer frame and the aperture module to prevent unwanted light incidence into the image sensor device and shield parts of regions over the set of optical elements, and comprising an opening precisely aligned with an aperture opening of the aperture module; 
 a first transparent substrate between the image sensor array chip and the set of optical elements, wherein the image sensor array chip is attached on the first transparent substrate; 
 a second transparent substrate between the first transparent substrate and the set of optical elements, wherein the second transparent substrate is spaced from the set of optical elements, and wherein the second transparent substrate occupies parts of an upper surface of the first transparent substrate; and 
 a protection layer, 
 wherein a first surface of the protection layer is attached to the image sensor array chip, and 
 wherein the image sensor array chip is arranged between the first transparent substrate and at least a portion of the protective layer. 
 
     
     
       12. The device as claimed in  claim 11 , wherein the set of optical elements comprises a set of lenses configured with an aperture. 
     
     
       13. The device as claimed in  claim 12 , wherein the opaque coating leaves the set of lenses exposed by the aperture opening. 
     
     
       14. The device as claimed in  claim 11 , wherein
 the footprint of the first transparent substrate is larger than that of the set of optical elements; and 
 the outer frame and the overlying opaque coating extend to overlie the unoccupied upper surface of the first transparent substrate. 
 
     
     
       15. The device as claimed in  claim 14 , wherein the outer frame further extends to a side surface of the first transparent substrate. 
     
     
       16. The device as claimed in  claim 11 , wherein
 the footprint of first the transparent substrate is smaller than that of the set of optical elements; and 
 the outer frame and the opaque coating extend to be between the first and second transparent substrates and leave an image sensor array of the image sensor array chip exposed. 
 
     
     
       17. The device as claimed in  claim 11 , further comprising an opaque layer, the opaque layer attached to a second surface, opposite to the first surface, of the protection layer. 
     
     
       18. The device as claimed in  claim 11 , wherein the opaque coating conformally overlies the outer frame and the aperture module due to spraying, spin coating, dipping, tapping, or sputtering. 
     
     
       19. The device as claimed in  claim 11 , wherein the opaque coating is an acrylic resin or epoxy resin overlying the outer frame and the aperture module. 
     
     
       20. The device as claimed in  claim 11 , wherein the opaque coating extends to an edge of the aperture opening of the aperture module, thus forming the opening of the opaque coating that is precisely aligned with the aperture opening of the aperture module.