Coplanar waveguide

Abstract

An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes.

What is claimed is: 
     
       1. An integrated circuit, comprising:
 a substrate; 
 a first waveguide portion disposed at a first level over the substrate and including at least one first conductor; and 
 a second waveguide portion disposed over the substrate at substantially the first level and including at least one second conductor and at least one nonconductive region disposed within and surrounded by the at least one second conductor, the non-conductive region positioned to reduce magnetic effect current losses in the at least one first conductor. 
 
     
     
       2. The integrated circuit of  claim 1 , wherein the substrate comprises a high resistivity substrate, and wherein the first waveguide portion and the second waveguide portion comprise a plurality of metallization layers any one of which is configured to carry a microwave signal. 
     
     
       3. The integrated circuit of  claim 1  wherein the substrate comprises a high-resistivity substrate, and wherein the first waveguide portion and the second waveguide portion comprise a plurality of metallization layers at least any two metallization layers of which are electrically connected together to propagate a microwave signal. 
     
     
       4. The integrated circuit of  claim 1 , wherein the second waveguide portion comprises an electrically conducting material and the non-conductive region comprises a plurality of holes. 
     
     
       5. The integrated circuit of  claim 4 , wherein the holes are spread over lines parallel to the first waveguide portion, each parallel line with holes comprising identical holes. 
     
     
       6. The integrated circuit of  claim 1 , wherein the second waveguide portion comprises a gradient of metallic density from the first waveguide portion towards a periphery of the second waveguide portion. 
     
     
       7. The integrated circuit of  claim 6 , wherein the gradient of metallic density decreases from the first waveguide portion towards the periphery of the second waveguide portion. 
     
     
       8. A system, comprising:
 a first integrated circuit, including:
 a first substrate; 
 a first waveguide portion disposed at a first level over the substrate and including first conductors that are connected to one another through conductive vias; and 
 a second waveguide portion disposed over the first substrate at substantially the first level and including at least one second conductor configured to reduce magnetic effect current losses in the first conductors; and 
 
 
       a second integrated circuit coupled to the first integrated circuit. 
     
     
       9. The system of  claim 8  wherein the second integrated circuit is disposed on the first substrate. 
     
     
       10. The system of  claim 8  wherein the second integrated circuit is disposed on a second substrate. 
     
     
       11. A system, comprising:
 a first integrated circuit, including: 
 a substrate; 
 a first waveguide portion disposed at a first level over the substrate and including at least one first conductor; and 
 a second waveguide portion disposed over the substrate at substantially the first level and including at least one second conductor and at least one nonconductive region disposed within and surrounded by the at least one second conductor, the non-conductive region positioned to reduce magnetic-effect current losses in the at least one first conductor; and 
 a second integrated circuit coupled to the first integrated circuit. 
 
     
     
       12. A method, comprising:
 receiving a microwave signal with an integrated circuit; and 
 coupling the signal from one location of the integrated circuit to another location of the integrated circuit via a waveguide including:
 a first waveguide portion disposed at a level over a substrate and including first signal conductors, wherein the first signal conductors are electrically coupled to one another through conductive vias; and 
 a second waveguide portion disposed over the substrate at substantially the level and including at least one second conductor positioned to reduce magnetic-effect current losses in the first signal conductors. 
 
 
     
     
       13. A method, comprising:
 receiving a microwave signal with an integrated circuit; and 
 coupling the signal from one location of the integrated circuit to another location of the integrated circuit with a waveguide comprising
 a first waveguide portion disposed at a first level over the substrate and including at least one first conductor, and 
 a second waveguide portion disposed over the substrate at substantially the first level and including at least one second conductor and at least one nonconductive region disposed within and surrounded by the at least one second conductor, the non-conductive region positioned to reduce magnetic-effect current losses in the at least one first conductor.