US8956481B2ActiveUtilityPatentIndex 45
Method of assembling carbon parts by refractory brazing
Est. expirySep 5, 2028(~2.2 yrs left)· nominal 20-yr term from priority
C04B 2237/363C04B 2235/6565C04B 2235/728C04B 2235/662C04B 2237/083C04B 37/005C04B 2235/6567B23K 35/0233Y10T428/25C04B 2235/425C04B 2237/708C04B 2235/656B23K 35/327B23K 35/005C04B 2237/16C04B 2235/5436C04B 35/573B23K 35/30C04B 35/00
45
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Claims
Abstract
The present invention relates to a method of assembling carbon parts using a braze based on silicon carbide. The invention also relates to the parts assembled using such a method.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A method for joining at least two carbon parts having a particle size lower than 10 μm, the method comprising the steps of:
a) positioning the carbon parts to be joined and a silicon element, said silicon element being inserted between said carbon parts, and
b) maintaining the assembly formed in step a) cohesive under pressure and subjecting it to heating at a temperature between 1410° C. and 1500° C. under an inert atmosphere for a period of 10 minutes to 1 hour, to melt the silicon and form a joint containing at least one silicon carbide bridge at an interface of said carbon parts, and
c) exposing the assembly obtained after step b) to a temperature higher than the temperature of step b) and between 1500° C. and 1750° C., for a period of 3 to 8 hours to consume all of the silicon and form a silicon carbide joint on the whole surface of the interface of said carbon parts.
2. The method as claimed in claim 1 , wherein the silicon carbide joint obtained after step c) is completely devoid of residual solid silicon.
3. The method as claimed in claim 1 , wherein the carbon parts have an open-cell porosity of 0 to 40% by volume.
4. The method as claimed in claim 1 , wherein the carbon parts have a particle size of 1 to 5 μm.
5. The method as claimed in claim 1 , wherein the joint formed at the interface of the two joined parts has a thickness between 10 and 40 μm.
6. The method as claimed in claim 1 , wherein the silicon element in step a) is in the form of a silicon strip.
7. The method as claimed in claim 1 , wherein the joint formed at the interface of the two joined parts has a thickness between 20 and 30 μm.
8. The method as claimed in claim 1 , wherein step b) comprises the heating under inert atmosphere for 20 to 40 minutes.
9. The method as claimed in claim 1 , wherein step b) is carried out at a temperature between 1430° C. and 1500° C.
10. The method as claimed in claim 1 , wherein step c) is carried out at a temperature between 1600° C. and 1700° C.Cited by (0)
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