Heat-dissipating structure for an LED lamp

Abstract

A heat-dissipating structure for an LED lamp has a lamp cover, and a power conversion device and a ceramic substrate mounted inside the lamp cover. The lamp cover has multiple heat-dissipating holes and multiple mounting ears. Each mounting ear is formed on an edge of one of the heat-dissipating holes and is bent inwardly with the heat-dissipating hole uncovered. The ceramic substrate is mounted on the mounting ears. The ceramic substrate has multiple LEDs mounted thereon, absorbs heat generated when the LEDs emit light and conducts the heat to the lamp cover through the mounting ears. The heat generated when the LEDs are lit and the power conversion converts a mains power is transferred to a heat convection space between the ceramic substrate and the lamp cover, and is further dissipated to an ambient environment, thereby achieving fast heat dissipation and a light LED lamp without an additional heat sink thereon.

What is claimed is: 
     
       1. A heat-dissipating structure for LED lamp comprising:
 a lamp cover having:
 a peripheral wall of a funnel shape and having a front annular orifice and a rear annular orifice; and 
 multiple mounting ears formed in the peripheral wall spaced from and intermediate the front and rear annular orifices, wherein each mounting ear is bent inwardly from the peripheral wall to define a heat-dissipating hole spaced from and intermediate the front and rear annular orifices and matching the mounting ear in size in the peripheral wall; 
 
 a ceramic substrate mounted inside the lamp cover intermediate the front and rear annular orifices, securely mounted on the mounting ears, and having:
 multiple light-emitting diodes (LEDs) mounted on the ceramic substrate, wherein light generated by the multiple LEDs is reflected by the lamp cover to generate uniform light, and 
 an air passage hole centrally formed through the ceramic substrate; 
 
 a power cap mounted inside the lamp cover between the rear annular orifice of the lamp cover and the ceramic substrate; 
 a power conversion device mounted on the rear annular orifice of the lamp cover, facing the ceramic substrate, and electrically connected to the multiple LEDs on the ceramic substrate; and 
 a heat convection space surrounded by the ceramic substrate, the power cap, and the lamp cover, being hollow, and communicating with the heat-dissipating holes and the air passage, wherein heat generated by the LEDs is absorbed by the ceramic substrate and conducted to the mounting ears and the lamp cover, wherein heat absorbed by the ceramic substrate is transferred to the heat convection space by way of heat convection, wherein the power cap isolates heat generated by the LEDs, wherein heat generated by the power conversion device and absorbed by the power cap is transferred to the heat convection space, wherein heat on the lamp cover is transferred to ambient air, and wherein heat accumulating in the heat convection space is transferred to the ambient air through the heat-dissipating holes of the lamp cover and through the air passage hole. 
 
     
     
       2. The heat-dissipating structure for LED lamp as claimed in  claim 1 , wherein the power cap mounted inside the lamp cover has a cable hole formed through the power cap. 
     
     
       3. The heat-dissipating structure for LED lamp as claimed in  claim 2 , wherein:
 each mounting ear has a through hole formed through the mounting ear; 
 the ceramic substrate further has:
 multiple threaded holes, with each threaded hole formed through the ceramic substrate to correspond to the through hole of a corresponding mounting ear; and 
 multiple bolts, with each bolt mounted through one of the threaded holes of the ceramic substrate and the through hole of the corresponding mounting ear and screwed with a nut. 
 
 
     
     
       4. The heat-dissipating structure for LED lamp as claimed in  claim 1 , wherein at least one power cable is connected between the power conversion device and the ceramic substrate. 
     
     
       5. The heat-dissipating structure for LED lamp as claimed in  claim 2 , wherein at least one power cable is connected between the power conversion device and the ceramic substrate. 
     
     
       6. The heat-dissipating structure for LED lamp as claimed in  claim 3 , wherein at least one power cable is connected between the power conversion device and the ceramic substrate.