Light emitting diode package unit, method for manufacturing the same and backlight

Abstract

A light emitting diode package unit, a method for manufacturing the same and a backlight are disclosed. The light emitting diode package unit comprising a LED chip and a light uniformization structure formed above the LED chip in the direction of exiting light.

What is claimed is: 
     
       1. A light emitting diode (LED) package unit, comprising:
 a LED chip; and 
 a light uniformization structure, formed above the LED chip in a direction of exiting light, 
 wherein the light uniformization structure is only provided on a periphery part of the light emitting diode package unit but not provided in a center planar part inside the periphery part of the light emitting diode package unit, and the light uniformization structure is configured for converging light exiting from two side parts along a length direction of the light emitting diode package unit, 
 wherein at least three triple prism columns which are arranged parallel to each other are disposed on each of the two side parts along the length direction of the LED chip and above the LED chip, the apex angle of the triple prism columns on one of the two side parts decrease in an equidifferent manner in a direction of leaving the LED chip; 
 a base part of each triple prism column faces downwards and an apex angle opposite to the base part faces upwards, and the triple prism columns are perpendicular to the length direction of the LED chip and are arranged parallel to each other. 
 
     
     
       2. The light emitting diode package unit according to  claim 1 , further comprising a package element covering and surrounding the LED chip for packaging the LED chip, wherein the light uniformization structure is directly formed on an upper surface of the package element. 
     
     
       3. The light emitting diode package unit according to  claim 2 , wherein the package element comprises epoxy resin. 
     
     
       4. The light emitting diode package unit according to  claim 1 , further comprising:
 a package element covering and surrounding the LED chip for packaging the LED chip; and 
 a light uniformization plate on the package element, 
 wherein the light uniformization structure is formed on an upper surface of the light uniformization plate. 
 
     
     
       5. The light emitting diode package unit according to  claim 4 , wherein the package element comprises epoxy resin. 
     
     
       6. The light emitting diode package unit according to  claim 4 , wherein the light uniformization plate is formed of polythene. 
     
     
       7. The light emitting diode package unit according to  claim 1 , wherein among the triple prism columns on one of the two side parts, the triple prism column closest to the LED chip has an apex angle of (180-C) degrees, and the triple prism column farthest from the LED chip has an apex angle of 90 degrees, where C is a critical angle of a material adopted to form the triple prism column. 
     
     
       8. The light emitting diode package unit according to  claim 1 , wherein an angle between a line connecting a position of the light uniformization structure closest to the LED chip with the LED chip and a vertical direction is in a range from 30 degrees to 35 degrees. 
     
     
       9. A backlight, comprising:
 a light guide plate, and 
 at least two LED package units disposed on one side of the light guide plate, 
 wherein the at least two LED package units comprise the light emitting diode package unit according to  claim 1 . 
 
     
     
       10. A method for manufacturing a backlight, comprising:
 fixing a LED chip; 
 packaging the LED chip with a packaging material; and 
 forming a light uniformization structure above the LED chip in a direction of exiting light, 
 wherein the light uniformization structure is only provided on a periphery part of the light emitting diode package unit but not provided in a center planar part inside the periphery part of the light emitting diode package unit, and the light uniformization structure is configured for converging light exiting from two side parts along a length direction of the light emitting diode package unit, 
 wherein at least three triple prism columns which are arranged parallel to each other are disposed on each of the two side parts along the length direction of the LED chip and above the LED chip, the apex angle of the triple prism columns on one of the two side parts decrease in an equidifferent manner in a direction of leaving the LED chip; 
 a base part of each triple prism column faces downwards and an apex angle opposite to the base part faces upwards, and the triple prism columns are perpendicular to the length direction of the LED chip and are arranged parallel to each other. 
 
     
     
       11. The method according to  claim 10 , wherein the step of forming a light uniformization structure above the LED chip in a direction of exiting light comprises:
 placing a light uniformization plate on the packaging material before curing the packaging material; and 
 curing the packaging material, so as to bond the light uniformization plate with the packaging material.